GR1B, GR1C, GR1D Selling Leads, Datasheet
MFG:TS Package Cooled:2009 D/C:09+
GR1B, GR1C, GR1D
- Table of contents:
Info of GR1B
Info of GR1C
Info of GR1D
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About GR1B
PDF/DataSheet Download
Datasheet: GR1B
File Size: 172743 KB
Manufacturer: EIC [EIC discrete Semiconductors]
Download : Click here to Download
About GR1A
PDF/DataSheet Download
Datasheet: GR1A
File Size: 172743 KB
Manufacturer: EIC [EIC discrete Semiconductors]
Download : Click here to Download
About GR1D
PDF/DataSheet Download
Datasheet: GR1D
File Size: 172743 KB
Manufacturer: EIC [EIC discrete Semiconductors]
Download : Click here to Download
GR1B Maximum Ratings
| Symbols | GR1A | GR1B | GR1D | GR1G | GR1J | GR1K | GR1M | Units | |
| Maximum repetitive peak reverse voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | Volts |
| Maximum RMS voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | Volts |
| Maximum DC blocking voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | Volts |
| Maximum average forward rectified current at TL=90 | I(AV) | 1.0 | Amp | ||||||
| Peak forward surge current 8.3mS single half sine-wave superimposed on rated load (MIL-STD-750D 4066 method) TL=90 |
IFSM | 30.0 | Amp | ||||||
| Maximum instantaneous forward voltage at 1.0A | VF | 1.30 | Volts | ||||||
| Maximum DC reverse current TA=25 at rated DC blocking voltage TA=125 |
IR | 5.0 50.0 |
A | ||||||
| Maximum reverse recovery time (Note 1) | TN | 150 | 250 | 500 | nS | ||||
| Typical junction capacitance (Note 2) | CJ | 10.0 | 7.0 | F | |||||
| Maximum thermal resistance (Note 3) | RJA RJL |
105.0 32.0 |
/W | ||||||
| Operating junction and storage temperature range | TJ, TSTG | -55 to +150 | |||||||
GR1B Features
·Plastic package has Underwriters Laboratory
·Flammability Classification 94V-0
·For surface mounted applications in order to optimize board space
·Low profile package
·Built-in strain relief, ideal for automated placement
·Fast switching for high efficiency
·Glass passivated chip junction
·High temperature soldering: 250 /10 seconds at terminals
·Flammability Classification 94V-0
·For surface mounted applications in order to optimize board space
·Low profile package
·Built-in strain relief, ideal for automated placement
·Fast switching for high efficiency
·Glass passivated chip junction
·High temperature soldering: 250 /10 seconds at terminals
GR1D Maximum Ratings
| Symbols | GR1A | GR1B | GR1D | GR1G | GR1J | GR1K | GR1M | Units | |
| Maximum repetitive peak reverse voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | Volts |
| Maximum RMS voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | Volts |
| Maximum DC blocking voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | Volts |
| Maximum average forward rectified current at TL=90 | I(AV) | 1.0 | Amp | ||||||
| Peak forward surge current 8.3mS single half sine-wave superimposed on rated load (MIL-STD-750D 4066 method) TL=90 |
IFSM | 30.0 | Amp | ||||||
| Maximum instantaneous forward voltage at 1.0A | VF | 1.30 | Volts | ||||||
| Maximum DC reverse current TA=25 at rated DC blocking voltage TA=125 |
IR | 5.0 50.0 |
A | ||||||
| Maximum reverse recovery time (Note 1) | TN | 150 | 250 | 500 | nS | ||||
| Typical junction capacitance (Note 2) | CJ | 10.0 | 7.0 | F | |||||
| Maximum thermal resistance (Note 3) | RJA RJL |
105.0 32.0 |
/W | ||||||
| Operating junction and storage temperature range | TJ, TSTG | -55 to +150 | |||||||
GR1D Features
·Plastic package has Underwriters Laboratory
·Flammability Classification 94V-0
·For surface mounted applications in order to optimize board space
·Low profile package
·Built-in strain relief, ideal for automated placement
·Fast switching for high efficiency
·Glass passivated chip junction
·High temperature soldering: 250 /10 seconds at terminals
·Flammability Classification 94V-0
·For surface mounted applications in order to optimize board space
·Low profile package
·Built-in strain relief, ideal for automated placement
·Fast switching for high efficiency
·Glass passivated chip junction
·High temperature soldering: 250 /10 seconds at terminals
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