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Maximum average forward TC=60°C (NOTE 2) rectified output current at TA=25°C (NOTE 3)
I(AV)
3.0 2.0
Amps
Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method) TC=60°C
IFSM
60.0
Amps
Rating for fusing (t<8.3ms)
I2t
15.0
A2sec
Maximum instantaneous forward voltage drop per leg at 1.5 Amperes
VF
1.0
Volts
Maximum DC reverse current at rated TA= 25°C 5.0 DC blocking voltage per leg TA=125°C
IR
5.0 500.0
A
Typical junction capacitance per leg (NOTE 4)
CJ
21.0
pF
Typical thermal resistance per leg (NOTE 2)
RQJA RQJC
12.0 8.0
°C/W
Operating junction and storage temperature range
TJ, TSTG
-55 to +150
°C
NOTES: (1) Bolt down on heat-sink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #6 screw (2) Unit mounted on 4.0 x 4.0 x 0.11" thick (10.5 x 10.5 x 0.3cm) Al. Plate (3) Unit mounted on P.C.B. at 0.375" (9.5mm) lead length with 0.5 x 0.5" (12 x 12mm) copper pads (4) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
GBPC110 Features
·Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ·This series is UL listed under Recognized Component Index,file number E54214 ·Glass passivated chip junctions ·High case dielectric with standing voltage of 1500 VRMS ·Typical IR less than 0.1mA ·High surge current capability ·Ideal for printed circuit boards ·High temperature soldering guaranteed: 260°C/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3kg) tension