GA600GD25S, GA600GD25SVA, GA600GS25SVA Selling Leads, Datasheet
MFG:IR Package Cooled:MOS+DIO D/C:09+
GA600GD25S, GA600GD25SVA, GA600GS25SVA Datasheet download
Part Number: GA600GD25S
MFG: IR
Package Cooled: MOS+DIO
D/C: 09+
GA600GD25S, GA600GD25SVA, GA600GS25SVA
- Table of contents:
Info of GA600GD25S
Info of GA600GD25SVA
Info of GA600GS25SVA
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About GA600GD25S
PDF/DataSheet Download
Datasheet: GA600GD25S
File Size: 651330 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
About GA600GD25S
PDF/DataSheet Download
Datasheet: GA600GD25S
File Size: 651330 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
About GA600GD25S
PDF/DataSheet Download
Datasheet: GA600GD25S
File Size: 651330 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
GA600GD25S Maximum Ratings
| Parameter | Max. | Units | |
| VCES | Collector-to-Emitter Breakdown Voltage | 250 | V |
| IC @ TC=25°C | Continuous Collector Current | 600 | A |
| ICM | Pulsed Collector Current | 1200 | |
| ILM | Peak Switching Current | 1200 | |
| IFM | Peak Diode Forward Current | 1200 | |
| VGE | Gate-to-Emitter Voltage | ± 17 | V |
| VISOL | RMS Isolation Voltage, Any Terminal to Case, t=1 min | 2500 | |
| PD @ TC=25°C | Maximum Power Dissipation | 1920 | W |
| PD @ TC=85°C | Maximum Power Dissipation |
1000 | |
| TJ | Operating Junction | -40 to + 150 | °C |
| TSTG | Storage Temperature Range | -40 to + 125 |
GA600GD25S Features
• Standard speed, optimized for battery powered application
• Very low conduction losses
• HEXFREDTM antiparallel diodes with ultra-soft recovery
• Industry standard package
• UL recognition pending
• Internal thermistor
• Very low conduction losses
• HEXFREDTM antiparallel diodes with ultra-soft recovery
• Industry standard package
• UL recognition pending
• Internal thermistor
GA600GD25S Typical Application
• Increased operating efficiency
• Direct mounting to heatsink
• Performance optimized for power conversion: UPS, SMPS, Welding
• Lower EMI, requires less snubbing
• Direct mounting to heatsink
• Performance optimized for power conversion: UPS, SMPS, Welding
• Lower EMI, requires less snubbing
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