DS33X162, DS33Z11, DS33Z44 Selling Leads, Datasheet
MFG:DALLAS Package Cooled:BGA D/C:N/A
DS33X162, DS33Z11, DS33Z44 Datasheet download
Part Number: DS33X162
MFG: DALLAS
Package Cooled: BGA
D/C: N/A
MFG:DALLAS Package Cooled:BGA D/C:N/A
DS33X162, DS33Z11, DS33Z44 Datasheet download
MFG: DALLAS
Package Cooled: BGA
D/C: N/A
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Datasheet: DS3
File Size: 68288 KB
Manufacturer: Linear
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PDF/DataSheet Download
Datasheet: DS33Z11
File Size: 1075128 KB
Manufacturer: MAXIM [Maxim Integrated Products]
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PDF/DataSheet Download
Datasheet: DS33Z44
File Size: 1104892 KB
Manufacturer: MAXIM [Maxim Integrated Products]
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The DS33Z11 is designed for use in the following applications:
·Transparent LAN Service
·LAN Extension
·Ethernet Delivery Over T1/E1/J1, T3/E3, OC-1/EC-1, G.SHDSL, or HDSL2/4
Refer also to Application Note 3411: DS33Z11óEthernet LAN to Unframed T1/E1 WAN Bridge for an example of a complete LAN to WAN design.
The DS33Z44 extends four 10/100 Ethernet LAN segments by encapsulating MAC frames in HDLC or X.86 (LAPS) for transmission over four PDH/TDM data streams. The serial links support bidirectional synchronous interconnect up to 52Mbps over xDSL, T1/E1/J1, T3/E3, V.35/Optical, OC-1/EC-1, or SONET/SDH Tributary.
The device performs store-and-forward of packets with full wire-speed transport capability. The built-in Committed Information Rate (CIR) controllers provide fractional bandwidth allocation up to the line rate in increments of 512kbps. The DS33Z44 can operate with an inexpensive external processor, EEPROM or in a stand-alone hardware mode.
Voltage Range on Any Lead with Respect to VSS (except VDD)........-0.5V to +5.5V
Supply Voltage Range (VDD3.3) with Respect to VSS........................-0.3V to +3.6V
Supply Voltage Range (VDD1.8) with Respect to VSS........................-0.3V to +2.0V
Ambient Operating Temperature Range.........................................-40°C to +85°C
Junction Operating Temperature Range.......................................-40°C to +125°C
Storage Temperature...................................................................-55°C to +125°C
Soldering Temperature...............................See IPC/JEDEC J-STD-020 Specification
These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time can affect reliability. Ambient Operating Temperature Range is assuming the device is mounted on a JEDEC-standard test board in a convection-cooled JEDEC test enclosure.
Note: The *typ* values listed below are not production tested.
· Four 10/100 IEEE 802.3 Ethernet MACs (MII and RMII) Half/Full Duplex with Automatic Flow Control
· Four 52Mbps Synchronous TDM Serial Ports with independent transmit and receive timing.
· HDLC/LAPS Encapsulation with Programmable FCS and Interframe Fill
· Committed Information Rate Controllers Provide Fractional Allocations in 512kbps Increments
· Programmable BERT for Serial (TDM) Interfaces
· External 16MB, 100MHz SDRAM Buffering
· Parallel Microprocessor Interface
· SPI Interface and Hardware Mode for Operation Without a Host Processor
· 1.8V Operation with 3.3V Tolerant I/O
· IEEE 1149.1 JTAG Support
· Transparent LAN Service
· LAN Extension Ethernet Delivery Over T1/E1/J1, T3/E3, OC-1/EC-1, G.SHDSL, or HDSL2/4