CX28310-14, CX28331, CX28333 Selling Leads, Datasheet
MFG:CONEXANT Package Cooled:BGA D/C:08+
CX28310-14, CX28331, CX28333 Datasheet download
Part Number: CX28310-14
MFG: CONEXANT
Package Cooled: BGA
D/C: 08+
MFG:CONEXANT Package Cooled:BGA D/C:08+
CX28310-14, CX28331, CX28333 Datasheet download
MFG: CONEXANT
Package Cooled: BGA
D/C: 08+
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Datasheet: CX2002
File Size: 59904 KB
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Datasheet: CX28331
File Size: 575610 KB
Manufacturer: CONEXANT [Conexant Systems, Inc]
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PDF/DataSheet Download
Datasheet: CX28333
File Size: 575610 KB
Manufacturer: CONEXANT [Conexant Systems, Inc]
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The CX28333 is a three-channel, E3/DS3/STS-1 fully-integrated Line Interface Unit (LIU). It is configured via external pins and does not need a microprocessor interface. Each channel has an independent equalizer on the receive side requiring no user configuration. Also, each channel has a programmable transmit pulse shaper that can be set to ensure that the cross-connect pulse mask requirement is met for transmit cable length up to 450 feet. The CX28332 is a dual-channel, and the CX28331 is a single-channel LIU with performance identical to the CX28333.
The CX28333 gives the user new economies of scale in concentrator applications where three DS3 or STS-1 channels are concentrated into a single STS-3 channel. By including three independent transceivers on a chip, significant external components are eliminated, with the exception of 1:1 coupling transformers, termination resistors, and supply bypass capacitors.
Symbol | Parameter | Min | Max | Unit |
DVDDC/ RVDD/ TVDD/ VDD |
Power Supply Voltage | 0.3 | 6 | V |
VI | Voltage on Any Signal Pin | 1.0 | VGG + 0.3 V | V |
TST | Storage Temperature | 40 | 125 | °C |
TVSOL | Vapor Phase Soldering Temperature (1 min.) |
- | 220 | °C |
JA | Thermal Resistance (Still air, socketed) |
- | 40 | °C/W |
JA | Thermal Resistance (Still air, soldered) |
- | 24 | °C/W |
Jc | - | - | 7.40 | °C/W |
FIT | Failures in time @ 89,000 device hours, temperature of 55 °C, 0 failures. |
- | 313 | fits |
NOTE(S): 1. Stresses above those listed as absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the other sections of this document is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
The CX28333 is a three-channel, E3/DS3/STS-1 fully-integrated Line Interface Unit (LIU). It is configured via external pins and does not need a microprocessor interface. Each channel has an independent equalizer on the receive side requiring no user configuration. Also, each channel has a programmable transmit pulse shaper that can be set to ensure that the cross-connect pulse mask requirement is met for transmit cable length up to 450 feet. The CX28332 is a dual-channel, and the CX28331 is a single-channel LIU with performance identical to the CX28333.
The CX28333 gives the user new economies of scale in concentrator applications where three DS3 or STS-1 channels are concentrated into a single STS-3 channel. By including three independent transceivers on a chip, significant external components are eliminated, with the exception of 1:1 coupling transformers, termination resistors, and supply bypass capacitors.
Symbol | Parameter | Min | Max | Unit |
DVDDC/ RVDD/ TVDD/ VDD |
Power Supply Voltage | 0.3 | 6 | V |
VI | Voltage on Any Signal Pin | 1.0 | VGG + 0.3 V | V |
TST | Storage Temperature | 40 | 125 | °C |
TVSOL | Vapor Phase Soldering Temperature (1 min.) |
- | 220 | °C |
JA | Thermal Resistance (Still air, socketed) |
- | 40 | °C/W |
JA | Thermal Resistance (Still air, soldered) |
- | 24 | °C/W |
Jc | - | - | 7.40 | °C/W |
FIT | Failures in time @ 89,000 device hours, temperature of 55 °C, 0 failures. |
- | 313 | fits |
NOTE(S): 1. Stresses above those listed as absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the other sections of this document is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |