Features: · 0.5mm CMOS TLM process· 3.3V or 5V operation with mixed mode I/O· 5V tolerance with reference voltage· PCI compliant outputs (3.3V / 5V)· Power dissipation:· 2.1mW / MHz / Gate @ 5V· 0.86mW / MHz / Gate @ 3.3V· 800 MHz maximum flip-flop toggle rate· Analog PLL operating frequency up to...
CX2002: Features: · 0.5mm CMOS TLM process· 3.3V or 5V operation with mixed mode I/O· 5V tolerance with reference voltage· PCI compliant outputs (3.3V / 5V)· Power dissipation:· 2.1mW / MHz / Gate @ 5V· 0.8...
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Symbol | Description | Min | Max | Unit |
VDD | Supply voltage | 0 | 7.0 | V |
VDDIO | I/O supply voltage | 0 | 5.5 | V |
VIN | DC input voltage | -0.3 | VDD+0.3 | V |
TJ | Junction temperature | 150 | °C | |
TSTG | Storage temperature | -65 | 150 | °C |
TSOL | Soldering lead temperature (10 seconds) | 210 | °C |
The CX2002 is a 0.5mm CMOS triple-metal module array product used for high-volume cost reduction, production. CX2002 provides a migration path from the prototyping and production phase that is typically done with the 0.6mm CX2001 product family.
The decrease in die size from 0.6mm to the 0.5mm technology allows for reduced production prices. In addition, the CX2002 features 25% lower power consumption and 20% higher core utilization than the comparable CX2001 device. The no-risk migration from the CX2001 family to the CX2002 technology is achieved by using the same synthesized netlist, test vectors, and package type.
Sixteen-week lead-time is available for highvolume production.