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C2952, C2953, C2955

C2952, C2953, C2955 Selling Leads, Datasheet

MFG:NEC  Package Cooled:CAN4  D/C:05+

C2952, C2953, C2955 Picture

C2952, C2953, C2955 Datasheet download

Five Points

Part Number: C2952

 

MFG: NEC

Package Cooled: CAN4

D/C: 05+

 

 

 
 
 
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C2952 Suppliers

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  • C2900-12

  • Vendor: NS Pack: PLCC D/C: 05+& Qty: 1200 Note: new and unuse&original,in stock  Adddate: 2024-12-19
  • Inquire Now
  • KFD (INTERNATIONAL)TRADING COMPANY   China
    Contact: Mr.PENGAlex   MSN:pengzefeng@hotmail.com
    Tel: 86-755-83209997//61309211
    Fax: 86-755-83207776
    (0)
  • C2900-19

  • Vendor: FTDI Pack: QFP D/C: 05+& Qty: 1700 Note: new and orignal  Adddate: 2024-12-19
  • Inquire Now
  • XYC ELECTRONIC COMPANY   China
    Contact: Ms.AiXun   MSN:sale.ic@hotmail.com
    Tel: 86-0755-61617705
    Fax: 86-0755-61617706
    (0)

About C2955

PDF/DataSheet Download

Datasheet: C2955

File Size: 68932 KB

Manufacturer: HAMAMATSU [Hamamatsu Corporation]

Download : Click here to Download

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C2953 Suppliers

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  • C2900-12

  • Vendor: NS Pack: PLCC D/C: 05+& Qty: 1200 Note: new and unuse&original,in stock  Adddate: 2024-12-19
  • Inquire Now
  • KFD (INTERNATIONAL)TRADING COMPANY   China
    Contact: Mr.PENGAlex   MSN:pengzefeng@hotmail.com
    Tel: 86-755-83209997//61309211
    Fax: 86-755-83207776
    (0)
  • C2900-19

  • Vendor: FTDI Pack: QFP D/C: 05+& Qty: 1700 Note: new and orignal  Adddate: 2024-12-19
  • Inquire Now
  • XYC ELECTRONIC COMPANY   China
    Contact: Ms.AiXun   MSN:sale.ic@hotmail.com
    Tel: 86-0755-61617705
    Fax: 86-0755-61617706
    (0)

About C2955

PDF/DataSheet Download

Datasheet: C2955

File Size: 68932 KB

Manufacturer: HAMAMATSU [Hamamatsu Corporation]

Download : Click here to Download

Related PDF Download

Related Part Number

C2955 Suppliers

More C2955 Suppliers

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  • C2900-12

  • Vendor: NS Pack: PLCC D/C: 05+& Qty: 1200 Note: new and unuse&original,in stock  Adddate: 2024-12-19
  • Inquire Now
  • KFD (INTERNATIONAL)TRADING COMPANY   China
    Contact: Mr.PENGAlex   MSN:pengzefeng@hotmail.com
    Tel: 86-755-83209997//61309211
    Fax: 86-755-83207776
    (0)
  • C2900-19

  • Vendor: FTDI Pack: QFP D/C: 05+& Qty: 1700 Note: new and orignal  Adddate: 2024-12-19
  • Inquire Now
  • XYC ELECTRONIC COMPANY   China
    Contact: Ms.AiXun   MSN:sale.ic@hotmail.com
    Tel: 86-0755-61617705
    Fax: 86-0755-61617706
    (0)

About C2955

PDF/DataSheet Download

Datasheet: C2955

File Size: 68932 KB

Manufacturer: HAMAMATSU [Hamamatsu Corporation]

Download : Click here to Download

Related PDF Download

Related Part Number

C2955 General Description

The C2955 is an IC internal inspection system incorporating an infrared microscope and an infrared CCD camera. Use of a newly developed infrared CCD camera enables a high sensitivity approximately ten times that of conventional systems (in comparisons by HAMAMATSU), at a wavelength of 1.0 m, making it possible to obtain sharp, clear images with high resolution. Using an infrared light which is transmitted through the silicon substrate enables observation of the interconnect lines in the IC, the wire bonding status, and the die bonding conditions, along with the diffusion zone conditions, without damaging the part under observation. Observation can be done from the back side, when the sample is prepared by scraping away the molding on the side opposite the surface of the silicon substrate. Because the metal wiring is never touched in the inspection process, precise testing can be carried out under optimum conditions, making it possible to inspect the condition of the diffusion zones, the multilayer interconnect lines, the Al-Si nodules wire bonding interfaces, and die bonding details.

C2955 Features

Best suited for flip-chip evaluation
No damage to part under observation
High sensitivity, high resolution
Built-in contrast enhancement function
Shading correction function

C2955 Typical Application

· Inspection of flip-chip and other packaged IC devices
· Testing for abnormalities (defects, failures) in metal and polysilicon wiring
· Observation of wire bonding
· Observation of various types of die bonding zones
· Simultaneous inspection of Al-Si nodules and multiple patterns
· Observation of pattern diffusion into substrate
· Identification of ESD failure locations

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