BZG01-C82, BZG03, BZG03-15 Selling Leads, Datasheet
MFG:PHILIPS Package Cooled:SOD124 D/C:09+
BZG01-C82, BZG03, BZG03-15 Datasheet download
Part Number: BZG01-C82
MFG: PHILIPS
Package Cooled: SOD124
D/C: 09+
MFG:PHILIPS Package Cooled:SOD124 D/C:09+
BZG01-C82, BZG03, BZG03-15 Datasheet download
MFG: PHILIPS
Package Cooled: SOD124
D/C: 09+
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PDF/DataSheet Download
Datasheet: BZG01-C82
File Size: 45300 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BZG03
File Size: 32309 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BZG01
File Size: 45300 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
Ptot | total power dissipation | Ttp = 100 °C; see Fig.2 | - | 3.00 | W |
Ptot | total power dissipation | Tamb = 50 °C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) | - | 1.25 | W |
PZSM | non-repetitive peak reverse power dissipation | tp = 100 ms; square pulse; Tj = 25 °C prior to surge; see Fig.3 |
- | 600 | W |
Tstg | storage temperature | -65 | +175 | °C | |
Tj | junction temperature | -65 | +175 | °C |