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BYV97D, BYV97E, BYV97G

BYV97D, BYV97E, BYV97G Selling Leads, Datasheet

MFG:NXP  Package Cooled:2003+  D/C:09+(ROHS)

BYV97D, BYV97E, BYV97G Picture

BYV97D, BYV97E, BYV97G Datasheet download

Five Points

Part Number: BYV97D

 

MFG: NXP

Package Cooled: 2003+

D/C: 09+(ROHS)

 

 

 
 
 
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About BYV 10- 40

PDF/DataSheet Download

Datasheet: BYV 10- 40

File Size: 74687 KB

Manufacturer: STMicro

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About BYV 10- 40

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Datasheet: BYV 10- 40

File Size: 74687 KB

Manufacturer: STMicro

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About BYV97G

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Datasheet: BYV97G

File Size: 57886 KB

Manufacturer: PHILIPS [Philips Semiconductors]

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BYV97G General Description

Rugged glass SOD57 package, using a high temperature alloyed construction.This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

BYV97G Maximum Ratings

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage 1400 V
VR continuous reverse voltage 1400  V
I F(AV) average forward current Ttp =60 ; lead length=10 mm see Fig.2;
averaged over any 20 ms period;see also Fig.6
Tamb =50 ; PCB mounting
(see Fig. 12); see Fig.3;
averaged over any 20 ms period;see also Fig.6

1.6



0.9


A
IFRM repetitive peak forward current Ttp =65 °C; see Fig.4
Tamb =65 °C; see Fig.5

15
8
A
IFSM non-repetitive peak forward current t = 10 ms half sine wave;
Tj =Tj max prior to surge;
VR =VRRMmax

20 A
E RSM non-repetitive peak reverse avalanche energy L = 120 mH; Tj =Tj max prior to surge; inductive load switched off 10 mJ
Tstg storage temperature -65 +175
Tj operating junction temperature see Fig.7 -65 +175

BYV97G Features

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Available in ammo-pack.

BYV97G Connection Diagram

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