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BYM26F, BYM26G, BYM300A120DN2

Table of contents:
Info of BYM26F
Info of BYM26G
Info of BYM300A120DN2

BYM26F, BYM26G, BYM300A120DN2 Selling Leads, Datasheet

MFG:PHILIPS Package Cooled:SOD-64 D/C:05+

BYM26F, BYM26G, BYM300A120DN2 Datasheet download

Five Points

Part Number: BYM26F

MFG: PHILIPS

Package Cooled: SOD-64

D/C: 05+

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BYM26F General Description

Rugged glass SOD64 package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

BYM26F Maximum Ratings

SYMBOL	PARAMETER	CONDITIONS	MIN.	MAX.	UNIT
V_RRM	repetitive peak reverse voltage			200	V
V_R	crest working reverse voltage			200	V
I _F(AV)	average forward current	Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16		2.30	A
I _F(AV)	average forward current	Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16		1.05	A
I_FRM	repetitive peak forward current	Ttp =55 °C; see Figs 8; 9 and 10		19	A
I_FRM	repetitive peak forward current	Tamb =65 °C; see Figs 11; 12 and 13		8.0	A
I_FSM	non-repetitive peak forward current	t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax		45	A
E_RSM	non-repetitive peak reverse avalanche energy	L = 120 mH; Tj =Tj max prior to surge; inductive load switched off		10	mJ

Tstg	storage temperature		-65	+175
Tj	operating junction temperature	see Figs 17 and 18		175

BYM26F Features

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Available in ammo-pack
* Also available with preformed leads for easy insertion.

BYM26F Connection Diagram

BYM26G General Description

Rugged glass SOD64 package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

BYM26G Maximum Ratings

SYMBOL	PARAMETER	CONDITIONS	MIN.	MAX.	UNIT
V_RRM	repetitive peak reverse voltage			200	V
V_R	crest working reverse voltage			200	V
I _F(AV)	average forward current	Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16		2.30	A
I _F(AV)	average forward current	Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16		1.05	A
I_FRM	repetitive peak forward current	Ttp =55 °C; see Figs 8; 9 and 10		19	A
I_FRM	repetitive peak forward current	Tamb =65 °C; see Figs 11; 12 and 13		8.0	A
I_FSM	non-repetitive peak forward current	t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax		45	A
E_RSM	non-repetitive peak reverse avalanche energy	L = 120 mH; Tj =Tj max prior to surge; inductive load switched off		10	mJ

Tstg	storage temperature		-65	+175
Tj	operating junction temperature	see Figs 17 and 18		175

BYM26G Features

BYM26G Connection Diagram

BYM300A120DN2 Maximum Ratings

Parameter	Symbol	Value	Unit
Drain source voltage T_j= 25 °C	V_R25	1200	V
DC current T_C = 25 °C T_C = 80 °C	F_DC	450 300	A
Pulsed diode current, tp = 1 ms T_C = 25 °C T_C = 80 °C	F_puls	900 600	A
i ²t-value, tP = 10 ms T_j= 0 °C	òi ²t	42000	A²s
Power dissipation per diode T_C = 25 °C	P_D	1000	W
Chip temperature	T_J	+ 150	°C
Storage temperature	T_stg	-55 ... + 150	°C
Thermal resistance, chip case	_RthJC	0.125	K/W
Insulation test voltage, t = 1min.	V_is	2500	Vac
Creepage distance	-	20	mm
Clearance	-	11	mm
DIN humidity category, DIN 40 040	-	F	sec
IEC climatic category, DIN IEC 68-1	-	55 / 150 / 56	sec

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