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BYM07-300, BYM07-400, BYM07-50

BYM07-300, BYM07-400, BYM07-50 Selling Leads, Datasheet

MFG:VISHAY  Package Cooled:DO-213AB  D/C:09+

BYM07-300, BYM07-400, BYM07-50 Picture

BYM07-300, BYM07-400, BYM07-50 Datasheet download

Five Points

Part Number: BYM07-300

 

MFG: VISHAY

Package Cooled: DO-213AB

D/C: 09+

 

 

 
 
 
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BYM07-300 Suppliers

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About BYM07-300

PDF/DataSheet Download

Datasheet: BYM07-300

File Size: 87380 KB

Manufacturer: GE [General Semiconductor]

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BYM07-400 Suppliers

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About BYM07-400

PDF/DataSheet Download

Datasheet: BYM07-400

File Size: 87380 KB

Manufacturer: GE [General Semiconductor]

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BYM07-50 Suppliers

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About BYM07-50

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Datasheet: BYM07-50

File Size: 87380 KB

Manufacturer: GE [General Semiconductor]

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BYM07-300 General Description

BYM07-50 thru BYM07-400 datasheet

BYM07-400 General Description

BYM07-50 thru BYM07-400 datasheet

BYM07-400 Maximum Ratings

SYMBOLS
EGL34A
EGL34B
EGL34C
EGL34D
EGL34F
EGL34G
UNITS
Maximum repetitive peak reverse voltage VRRM
50
100
150
200
300
400
V
Maximum RMS voltage VRSM
35
70
105
140
210
280
V
Maximum DC blocking voltage VDC
50
100
150
200
300
400
V
Maximum average forward rectified current
10mm lead length at TA = 55°C
F(AV)
0.5
A
Peak forward surge current 10ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
10.0
Am
Maximum instantaneous forward voltage at 1.0A VF
1.25
1.35
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=125°C
IR
5.0
50.0
Maximum reverse recovery time (NOTE 1) trr
50.0
Typical junction capacitance (NOTE 2) CJ
7.0
Maximum thermal resistance (I=10mm)

RJA
RJL

150.0
70.0
°C/W
Operating and storage temperature rang TJ TSTG
65 to +175
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal
(4) Thermal resistance from junction to terminal, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal

BYM07-400 Features

· Plastic package has Underwriters Laboratory Flammability Classification 94V-0
· Capable of meeting environmental standards of MIL-S-19500
· For surface mount applications
· High temperature metallurgically bonded construction
· Glass passivated cavity-free junction
· Fast switching for high efficiency
· High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath

BYM07-50 General Description

BYM07-50 thru BYM07-400 datasheet

BYM07-50 Maximum Ratings

  SYMBOLS
EGL34A
EGL34B
EGL34C
EGL34D
EGL34F
EGL34G
UNITS
Maximum repetitive peak reverse voltage VRRM
50
100
150
200
300
400
V
Maximum RMS voltage VRSM
35
70
105
140
210
280
V
Maximum DC blocking voltage VDC
50
100
150
200
300
400
V
Maximum average forward rectified current
10mm lead length at TA = 55°C
F(AV)
0.5
A
Peak forward surge current 10ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
10.0
Am
Maximum instantaneous forward voltage at 1.0A VF
1.25
1.35
 
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=125°C
IR
5.0
50.0
 
Maximum reverse recovery time (NOTE 1) trr
50.0
 
Typical junction capacitance (NOTE 2) CJ
7.0
 
Maximum thermal resistance (I=10mm)

RJA
RJL

150.0
70.0
°C/W
Operating and storage temperature rang TJ TSTG
65 to +175
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal
(4) Thermal resistance from junction to terminal, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal

BYM07-50 Features

· Plastic package has Underwriters Laboratory Flammability Classification 94V-0
· Capable of meeting environmental standards of MIL-S-19500
· For surface mount applications
· High temperature metallurgically bonded construction
· Glass passivated cavity-free junction
· Fast switching for high efficiency
· High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath

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