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BUZ338, BUZ339, BUZ34

Table of contents:
Info of BUZ338
Info of BUZ339
Info of BUZ34

BUZ338, BUZ339, BUZ34 Selling Leads, Datasheet

MFG:MOTOROLA Package Cooled:TO-3 D/C:05+

BUZ338, BUZ339, BUZ34 Datasheet download

Five Points

Part Number: BUZ338

MFG: MOTOROLA

Package Cooled: TO-3

D/C: 05+

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BUZ338 Maximum Ratings

Parameter	Symbol	Values	Unit
Continuous drain current T_C =28	I_D	13.5	A
Pulsed drain current T_C = 25	I_Dpuls	54
Avalanche current,limited by T_jmax	I_AR	13.5
Avalanche energy,periodic limited by T_jmax	E_AR	18	mJ
Avalanche energy, single pulse I_D =13.5A, V_DD = 50 V, R_GS = 25 L =9.18mH, T_j= 25	E_AS	930	mJ
Gate source voltage	V_GS	± 20	V
Power dissipation T_C = 25	P_tot	180	W
Operating temperature	T_j	-55 ... + 150
Storage temperature	T_stg	-55 ... + 150
Thermal resistance, chip case	R_thJC	0.7	K/W
Thermal resistance, chip to ambient	R_thJA	75	K/W
DIN humidity category, DIN 40 040		E
IEC climatic category, DIN IEC 68-1		55 / 150 / 56

BUZ338 Features

• N channel
• Enhancement mode
• Avalanche-rated

BUZ339 Maximum Ratings

Parameter	Symbol	Values	Unit
Continuous drain current T_C =33	I_D	11.5	A
Pulsed drain current T_C = 25	I_Dpuls	46
Avalanche current,limited by T_jmax	I_AR	11.5
Avalanche energy,periodic limited by T_jmax	E_AR	16	mJ
Avalanche energy, single pulse I_D =11.5A, V_DD = 50 V, R_GS = 25 L =10.8mH, T_j= 25	E_AS	790	mJ
Gate source voltage	V_GS	± 20	V
Power dissipation T_C = 25	P_tot	170	W
Operating temperature	T_j	-55 ... + 150
Storage temperature	T_stg	-55 ... + 150
Thermal resistance, chip case	R_thJC	0.74	K/W
Thermal resistance, chip to ambient	R_thJA	75	K/W
DIN humidity category, DIN 40 040		E
IEC climatic category, DIN IEC 68-1		55 / 150 / 56

BUZ339 Features

• N channel
• Enhancement mode
• Avalanche-rated

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