BUZ216, BUZ21L, BUZ22 Selling Leads, Datasheet
MFG:ST/SIE/INF Package Cooled:09+ D/C:04+
BUZ216, BUZ21L, BUZ22 Datasheet download
Part Number: BUZ216
MFG: ST/SIE/INF
Package Cooled: 09+
D/C: 04+
MFG:ST/SIE/INF Package Cooled:09+ D/C:04+
BUZ216, BUZ21L, BUZ22 Datasheet download
MFG: ST/SIE/INF
Package Cooled: 09+
D/C: 04+
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PDF/DataSheet Download
Datasheet: BUZ216
File Size: 175920 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ21L
File Size: 92313 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ22
File Size: 188185 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
Parameter | Symbol | Values | Unit |
Continuous drain current TC = 25 °C |
ID |
21 | A |
Pulsed drain current TC = 25 °C |
IDpuls | 84 | |
Avalanche current,limited by Tjmax |
IAR |
21 | |
Avalanche energy,periodic limited by Tjmax | EAR |
11.5 | mJ |
Avalanche energy, single pulse ID = 21 A, VDD = 25 V, RGS = 25 L = 340 µH, Tj= 25 °C |
EAS | 100 | |
Gate source voltage | VGS | ± 14 | V |
Gate-source peak voltage,aperiodic |
Vgs | ± 20 | |
Power dissipation TC = 25 °C |
Ptot | 75 | W |
Operating temperature | Tj | 55 . + 150 | °C |
Storage temperature range | Tstg | 55 . + 150 | |
Thermal resistance, chip case |
RthJC | 1.67 | K/W |
Thermal resistance, chip to ambient | RthJA |
75 | |
DIN humidity category, DIN 40 040 |
E | ||
IEC climatic category, DIN IEC 68-1 | 55 / 150 / 56 |
Parameter | Symbol | Values | Unit |
Continuous drain current TC =27 |
ID | 34 | A |
Pulsed drain current TC = 25 |
IDpuls | 136 | |
Avalanche current,limited by Tjmax | IAR | 34 | |
Avalanche energy,periodic limited by Tjmax |
EAR |
15 |
mJ |
Avalanche energy, single pulse |
EAS | 220 | |
Gate source voltage | VGS | ± 20 | V |
Power dissipation TC = 25 |
Ptot | 125 | W |
Operating temperature | Tj | -55 ... + 150 | |
Storage temperature | Tstg | -55 ... + 150 | |
Thermal resistance, chip case | RthJC | 1 | K/W |
Thermal resistance, chip to ambient | RthJA | 75 | |
DIN humidity category, DIN 40 040 | E | ||
IEC climatic category, DIN IEC 68-1 | 55 / 150 / 56 |