APM2014N, APM2014NUC, APM2014NUC-TR Selling Leads, Datasheet
MFG:APM Package Cooled:TO-252 D/C:06+
APM2014N, APM2014NUC, APM2014NUC-TR Datasheet download
Part Number: APM2014N
MFG: APM
Package Cooled: TO-252
D/C: 06+
APM2014N, APM2014NUC, APM2014NUC-TR
- Table of contents:
Info of APM2014N
Info of APM2014NUC
Info of APM2014NUC-TR
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About APM2014NU
PDF/DataSheet Download
Datasheet: APM2014NU
File Size: 432329 KB
Manufacturer: ANPEC
Download : Click here to Download
About APM2014NUC-TR
PDF/DataSheet Download
Datasheet: APM2014NUC-TR
File Size: 194942 KB
Manufacturer: Anpec Electronics Coropration
Download : Click here to Download
About APM2014NUC-TR
PDF/DataSheet Download
Datasheet: APM2014NUC-TR
File Size: 194942 KB
Manufacturer: Anpec Electronics Coropration
Download : Click here to Download
APM2014N Maximum Ratings
| Symbol | Parameter | Rating | Unit | |
| Common Ratings (TA=25°C Unless Otherwise Noted) | ||||
| VDSS | Drain-Source Voltage | 20 | V | |
| VGSS | Gate-Source Voltage | ±16 | ||
| TJ | Maximum Junction Temperature | 150 | °C | |
| TSTG | Storage Temperature Range | -55 to 150 | °C | |
| IS | Diode Continuous Forward Current | TC=25°C | 16 | A |
| Mounted on Large Heat Sink | ||||
| IDP | 300s Pulse Drain Current Tested | TC=25°C | 100 | A |
| TC=100°C | 75 | |||
| ID | Continuous Drain Current | TC=25°C | 40* | A |
| TC=100°C | 25 | |||
| PD | Maximum Power Dissipation | TC=25°C | 50 | W |
| TC=100°C | 20 | |||
| RJC | Thermal Resistance-Junction to Case | 2.5 | °C/W | |
| Mounted on PCB of 1in2 pad area | ||||
| IDP | 300s Pulse Drain Current Tested | TA=25°C | 100 | A |
| TA=100°C | 75 | |||
| ID | Continuous Drain Current | TA=25°C | 10 | A |
| TA=100°C | 6 | |||
| PD | Maximum Power Dissipation | TA=25°C | 2.5 | W |
| TA=100°C | 1 | |||
| RJC | Thermal Resistance-Junction to Ambient | 50 | °C/W | |
| Mounted on PCB of Minimum Footprint | ||||
| IDP | 300s Pulse Drain Current Tested | TA=25°C | 100 | A |
| TA=100°C | 75 | |||
| ID | Continuous Drain Current | TA=25°C | 9 | A |
| TA=100°C | 6 | |||
| PD | Maximum Power Dissipation | TA=25°C | 1.6 | W |
| TA=100°C | 0.6 | |||
| RJC | Thermal Resistance-Junction to Ambient | 75 | °C/W | |
Note:
* Current limited by bond wire.
APM2014N Features
· 20V/40A,
RDS(ON)=12mW (typ.) @ VGS=4.5V
RDS(ON)=18mW (typ.) @ VGS=2.5V
· Super High Dense Cell Design
· Reliable and Rugged
· Lead Free Available (RoHS Compliant)
RDS(ON)=12mW (typ.) @ VGS=4.5V
RDS(ON)=18mW (typ.) @ VGS=2.5V
· Super High Dense Cell Design
· Reliable and Rugged
· Lead Free Available (RoHS Compliant)
APM2014N Typical Application
Power Management in Desktop Computer or DC/DC Converters
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