AM79514, AM79520, AM7952SC Selling Leads, Datasheet
MFG:AMD Package Cooled:PLCC32 D/C:07+
AM79514, AM79520, AM7952SC Datasheet download
Part Number: AM79514
MFG: AMD
Package Cooled: PLCC32
D/C: 07+
MFG:AMD Package Cooled:PLCC32 D/C:07+
AM79514, AM79520, AM7952SC Datasheet download
MFG: AMD
Package Cooled: PLCC32
D/C: 07+
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Datasheet: AM79514
File Size: 800689 KB
Manufacturer: AMD [Advanced Micro Devices]
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PDF/DataSheet Download
Datasheet: AM7
File Size: 103780 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: AM7
File Size: 103780 KB
Manufacturer:
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Storage temperature ..................................55 to +150
VCC with respect to AGND/DGND .................0.4 V to +7.0 V
VEE with respect to AGND/DGND...................+0.4 V to 7.0 V
VBAT with respect to AGND/DGND................. +0.4 V to 70 V
Note: Rise time of VBAT (dv/dt) must be limited to 27 V/s or
less when QBAT bypass = 0.33 F.
BGND with respect to AGND/DGND.............. +1.0 V to 3.0 V
A(TIP) or B(RING) to BGND:
Continuous ................................................. 70 V to +1.0 V
10 ms (f = 0.1 Hz) ....................................... 70 V to +5.0 V
1 s (f = 0.1 Hz) ........................................... 90 V to +10 V
250 ns (f = 0.1 Hz) ..................................... 120 V to +15 V
Current from A(TIP) or B(RING)............................... ±150 mA
Voltage on RINGOUT .................... BGND to 70 V above QBAT
Voltage on TESTOUT ....... .............BGND to 70 V above QBAT
Current through relay drivers ......................................60 mA
Voltage on ring-trip inputs DA and DB .................VBAT to 0 V
Current into ring-trip inputs.................................. ...±10 mA
Peak current into regulator switch (L pin) .................150 mA
Switcher transient peak off voltage on L pin ..............+1.0 V
C4C1, E1, CHCLK,
to AGND/DGND....................................0.4 V to VCC + 0.4 V
Maximum power dissipation, (see note) ................TA = 70
In 32-pin PLCC package.............................................1.74 W
Note: Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165 . The device
should never be exposed to this temperature. Operation above 145 junction temperature may degrade device
reliability. See the SLIC Packaging Considerations for more information.
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.