MFG:8540 Package Cooled:08+ D/C:08+
AM29LV400BB-70SC, AM29LV400BB-70SE, AM29LV400BB-70SF Datasheet download
MFG: 8540
Package Cooled: 08+
D/C: 08+
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PDF/DataSheet Download
Datasheet: AM2055JC
File Size: 2449946 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AM2055JC
File Size: 2449946 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AM2055JC
File Size: 2449946 KB
Manufacturer:
Download : Click here to Download
The AM29LV400BB-70SC is one member of the AM29LV400B family which is designed as the 4 Mbit, 3.0 volt-only flash memory that organized as 524,288 bytes or 262,144 words. Features of the AM29LV400BB-70SC are:(1)2.7 to 3.6 V for read, program, and erase operations;(2)ideal for battery-powered applications;(3)manufactured on 0.32 m process technology;(4)high performance:60R, 70, 80, 90, or 120 ns access time;(5)low power consumption (typical values at 5 MHz):200 nA automatic sleep mode current, 200 nA standby mode current, 7 mA read current, 15 mA program/erase current;(6)flexible sector architecture such as supports full chip erase, one 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and seven 64 Kbyte sectors (byte mode) and one 8 Kword, two 4 Kword, one 16 Kword, and seven 32 Kword sectors (word mode);(7)quality and reliability levels equivalent to standard packaged components;(8)tested to datasheet specifications at temperature;(9)20-year data retention at 125°C;(10)hardware method to reset the device to reading array data.
The physical specifications of the AM29LV400BB-70SC can be summarized as:(1)die dimensions:185 mils x 140 mils;(2)die thickness:500 m;(3)bond pad size:4.69 mils x 4.69 mils and 115.9 m x 115.9 m;(4)pads per die:43;(5)bond pad metalization:Al/Cu;(6)die backside:no metal, may be grounded (optional);(7)passivation:Nitride/SOG/Nitride. If you want to know more information such as the electrical characteristics about the AM29LV400BB-70SC, please download the datasheet in www.seekic.com or www.chinaicmart.com .
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