AG603-89-PCB, AG604-7, AG604-86 Selling Leads, Datasheet
MFG:WJ Package Cooled:SOT89 D/C:2000
AG603-89-PCB, AG604-7, AG604-86 Datasheet download
Part Number: AG603-89-PCB
MFG: WJ
Package Cooled: SOT89
D/C: 2000
MFG:WJ Package Cooled:SOT89 D/C:2000
AG603-89-PCB, AG604-7, AG604-86 Datasheet download
MFG: WJ
Package Cooled: SOT89
D/C: 2000
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PDF/DataSheet Download
Datasheet: AG602-86
File Size: 192932 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AG602-86
File Size: 192932 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AG604-86
File Size: 200213 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
The AG604-86 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 900 MHz, the AG604-86 typically provides 20.5 dB of gain, +33 dBm Output IP3, and +19.5 dBm P1dB. The device combines dependable performance with consistent quality to maintain MTTF values exceeding 100 years at mounting temperatures of +85° C and is housed in a SOT-86 industry-standard SMT package.
The AG604-86 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT technology process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG604-86 will work for other various applications within the DC to 6 GHz frequency range such as CATV and fixed wireless.
Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature |
-40 to +85 -55 to +125 +7 V +10 dBm +250 |