MFG:Molex Connector Corporation Category:Connectors Package Cooled:smd/dip D/C:09+
75800-0001, 758-0018-00(L2A0604), 758-0019(SWIFT-01) Datasheet download
Category: Connectors
MFG: Molex Connector Corporation
Package Cooled: smd/dip
D/C: 09+
Description: CONN AMC B+ MEZZ 170POS 0.75MM
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PDF/DataSheet Download
Datasheet: 7580
File Size: 34295 KB
Manufacturer: GILWAY [Gilway Technical Lamp]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 7580
File Size: 34295 KB
Manufacturer: GILWAY [Gilway Technical Lamp]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 7580
File Size: 34295 KB
Manufacturer: GILWAY [Gilway Technical Lamp]
Download : Click here to Download
| Technical/Catalog Information | 75800-0001 |
| Vendor | Molex Connector Corporation |
| Category | Connectors |
| Card Thickness | 0.057" ~ 0.070" (1.44mm ~ 1.76mm) |
| Card Type | Advanced MC (AMC) |
| Contact Finish | Gold |
| Mounting Type | Through Hole, Right Angle, Press-Fit |
| Features | Board Guide |
| Number of Positions | 170 |
| Number of Rows | 2 |
| Pitch | 0.030" (0.76mm) |
| Packaging | Tray |
| Color | Black |
| Contact Finish Thickness | 30in (0.76m) |
| Gender | Female |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 75800 0001 758000001 WM17218 ND WM17218ND WM17218 |
The 75800-0001 is designed as one kind of 0.75mm (0.030') pitch AMC.0 B+ 170-circuit connectors. AMC.0 B+ connectors from molex support the next generation of mezzanine card standards and 12.5 Gbps speeds. The 170-circuit AMC.0 B+, or advancedMC connectors from molex support the next generation of mezzanine card standards that allow for hot-plugging of high-speed serial interconnects. These connectors support advancedTCA (advanced telecommunications computing architecture), a standard developed by PICMG (PCI industrial computer manufacturers group).
Typical applications include: (1) Telecommunications equipment. (2) For use in the IEEE 1386 market as it transitions to serial buses. (3) General "blade" computing applications. (4) Extended-height version used in non-ATCA applications. (5) Any hot-pluggable high-speed serial bus application.
It has four features. (1) Insert-molded wafer design provides excellent electrical performance. (2) Press-fit contacts and high-speed footprint for simpler application to PCB and superior signal integrity than competition. (3) Tin or Tin-Lead tail plating supports RoHS requirements and customer preferences for press-fit. (4) Meets PICMG Advanced MCTM specification and industry standard requirements. That are all the main features.
Also some important electrical specifications and other specifications about it. (1) Its comment would be with dignment pegs. (2) Its tail plating would be tin plated. (3) Its height would be 21.85mm (0.860'). (4) Its PCB peg would be yes. (5) Its voltage would be 250Vac. (6) Its current would be 1.5A power terminal and would be 1.0A other terminals. (7) Its contact resistance would be 60 milliohms max. (8) Its dielectric withstanding voltage would be 80V rms. (9) insulation resistance would be 500Vdc. (10) Its operating temperature range would be from -40°C to +105°C. (11) Its durability would be 300 cycles. (12) Its mating force would be 100N (22 lbf) max. And so on. If you have any question or suggestion or want to know more information please contact us for details. Thank you!
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