646490-901, 6465, 64650 Selling Leads, Datasheet
MFG:S/PHI Package Cooled:CDIP20 D/C:9120
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646490-901, 6465, 64650 Datasheet download
Part Number: 646490-901
MFG: S/PHI
Package Cooled: CDIP20
D/C: 9120
MFG:S/PHI Package Cooled:CDIP20 D/C:9120
646490-901, 6465, 64650 Datasheet download
MFG: S/PHI
Package Cooled: CDIP20
D/C: 9120
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PDF/DataSheet Download
Datasheet: 64602
File Size: 41240 KB
Manufacturer: OSRAM [OSRAM GmbH]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 64602
File Size: 41240 KB
Manufacturer: OSRAM [OSRAM GmbH]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 64602
File Size: 41240 KB
Manufacturer: OSRAM [OSRAM GmbH]
Download : Click here to Download
The LMC6484 provides a common-mode range that extends to both supply rails. This rail-to-rail performance combined with excellent accuracy, due to a high CMRR, makes this device unique among rail-to-rail input amplifiers.
It is ideal for systems, such as data acquisition, that require a large input signal range. The LMC6484 is also an excellent upgrade for circuits using limited common-mode range amplifiers such as the TLC274 and TLC279.
Maximum dynamic signal range is assured in low voltage and single supply systems by the LMC6484's rail-to-rail output swing. The LMC6484's rail-to-rail output swing is guaranteed for loads down to 600 Ohms.
Guaranteed low voltage characteristics and low power dissipation make the LMC6484 especially well-suited for battery-operated systems.
See the MNLMC6482AM-X data sheet for a Dual CMOS operational amplifier with these same features.
Supply Voltage (V+ - V-)
16V
Differential Input Voltage
±Supply Voltage
Voltage at Input/Output Pin
(V+)+0.3V,(V-)-0.3V
Current at Input Pin
(Note 6)
±5mA
Current at Output Pin
(Note 3, 5)
±30mA
Current at Power Supply Pin
40mA
Maximum Junction Temperature
(Note 4)
150 C
Power Dissipation
(Note 2)
315mW
Storage Temperature Range
-65 C to +150 C
Operating Temperature Range
-55 C TA +125 C
Thermal Resistance
ThetaJA
14-Pin CERAMIC DIP (Still Air) 86.0 C/W
(500LF/Min Air flow) 49.0 C/W
14-Pin CERAMIC SOIC (Still Air) 116.0 C/W
(500LF/Min Air Flow) 72.0 C/W
ThetaJC
14-Pin CERAMIC DIP 16.0 C/W
14-Pin CERAMIC SOIC 11.0 C/W
Package Weight
CERAMIC DIP TBD
CERAMIC SOIC 460mg
Lead Temperature
(Soldering, 10 seconds) 260 C
ESD Tolerance
(Note 7)
3.0kV
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150 C. Output currents in excess of +30mA over long term may adversely affect reliability.
Note 4: All numbers apply for packages soldered directly into a PC board.
Note 5: Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.