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6400, 64000, 640000

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6400, 64000, 640000 Selling Leads, Datasheet

MFG:M24C02-RDW6TP Package Cooled:ST D/C:NICHICON

6400, 64000, 640000 Datasheet download

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Part Number: 6400

MFG: M24C02-RDW6TP

Package Cooled: ST

D/C: NICHICON

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6400 General Description

The LM2595-5.0 is a monolithic integrated circuit that provides all the active functions for a step-down (buck) switching regulator, capable of driving a 1A load with excellent line and load regulation.

Requiring a minimum number of external components, this regulator is simple to use and includes internal frequency compensation and a fixed-frequency oscillator.

The LM2595 operates at a switching frequency of 150KHz thus allowing smaller sized filter components than lower frequency switching regulators.

A standard series of inductors are available from several different manufacturers,optimized for use with the LM2595. This feature greatly simplifies the design of switch-mode power supplies.

Other features include a guaranteed +4% tolerance on output voltage within specified input voltages and output load conditions, and +10% on the oscillator frequency. External shutdown is included, featuring typically 80uA standby current. Self protection features include a two stage current limit for the output switch and an over temperature shutdown for complete protection under fault conditions.

6400 Maximum Ratings

Maximum Supply Voltage
                                                                                 45V
ON/OFF Pin Input Voltage
                                                                                 -0.3 < V < +25V
Feedback Pin Voltage
                                                                                 -0.3 < V < +25V
Output Voltage to Ground
(steady state)                                                          -1V
Power Dissipation
(Note 2, 3)
                                                                                  Internally Limited
Storage Temperature Range
                                                                                  -65 C to +150 C
ESD Susceptibility
(Note 4)
                                                                                  2kV
Lead Temperature
Soldering, (10 seconds)                                            +260 C
Maximum Junction Temperature
                                                                                   +150 C
Thermal Resistance
ThetaJA
   16-Pin CERAMIC DIP   (Still Air @ 0.5W)                   75 C/W
                        (500LF/Min Air flow @ 0.5W)               35 C/W
ThetaJC
   16-Pin CERAMIC DIP                                                 2 C/W
(Note 3)
Package Weight
(Typical)
16 - Pin Ceramic Dip                                                    1920mg
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower.

Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance, and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.

Note 4: Human body model, 1.5K Ohms in series with 100pF.

6400 Features

- Guaranteed 1A output load current
- Input voltage range up to 40V
- Requires only 4 external components
- Excellent line and load regulation specifications
- 150KHz fixed frequency internal oscillator
- TTL Shutdown capability
- Low power standby mode, Iq typically 80uA
- High Efficiency
- Uses readily available standard inductors
- Thermal shutdown and current limit protection
- CONTROLLING DOCUMENT:
LM2595J-5.0-QML 5962-9650301QEA

6400 Typical Application

- Simple high-efficiency step-down (buck) regulator
- Efficient pre-regulator for linear regulators
- On-card switching regulators
- Positive to Negative converter

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