58328, 5833, 583304ESB2 Selling Leads, Datasheet
MFG:NS Package Cooled:NS D/C:00+
MFG:NS Package Cooled:NS D/C:00+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: 5832
File Size: 80169 KB
Manufacturer: ALLEGRO [Allegro MicroSystems]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 5833
File Size: 157677 KB
Manufacturer: ALLEGRO [Allegro MicroSystems]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 5832
File Size: 80169 KB
Manufacturer: ALLEGRO [Allegro MicroSystems]
Download : Click here to Download
Designed to reduce logic supply current, chip size, and system cost, the UCN5833A/EP integrated circuits offer high-speed operation for thermal printers. These devices can also be used to drive multiplexed LED displays or incandescent lamps within their 125 mA peak output current rating. The combination of bipolar and MOS technologies gives BiMOS II smart power ICs an interface flexibility beyond the reach of standard buffers and power driver circuits.
These 32-bit drivers have bipolar open-collector npn Darlington outputs, a CMOS data latch for each of the drivers, a 32-bit CMOS shift register, and CMOS control circuitry. The high-speed CMOS shift registers and latches allow operation with most microprocessor-based systems at data input rates above 3.3 MHz. Use of these drivers with TTL may require input pull-up resistors to ensure an input logic high.
The UCN5833A is supplied in a 40-pin dual in-line plastic package with 0.600" (15.24 mm) row spacing. At an ambient temperature of +75°C, all outputs of the DlP-packaged device will sustain 50 mA continuously. For high-density applications, the UCN5833EP is available. This 44-lead plastic chip carrier (quad pack) is intended for surface-mounting on solder lands with 0.050" (1.27 mm) centers. CMOS serial data outputs permit cascading for applications requiring additional drive lines.