3KBP06M, 3KBP08M, 3KE13 Selling Leads, Datasheet
MFG:Vishay Package Cooled:KBPM D/C:2010+
3KBP06M, 3KBP08M, 3KE13 Datasheet download
Part Number: 3KBP06M
MFG: Vishay
Package Cooled: KBPM
D/C: 2010+
3KBP06M, 3KBP08M, 3KE13
- Table of contents:
Info of 3KBP06M
Info of 3KBP08M
Info of 3KE13
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About 3KBP06M
PDF/DataSheet Download
Datasheet: 3KBP06M
File Size: 96224 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
About 3KBP08M
PDF/DataSheet Download
Datasheet: 3KBP08M
File Size: 96224 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
About
PDF/DataSheet Download
Datasheet:
File Size: KB
Manufacturer:
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3KBP06M General Description
3KBP005M thru 3KBP10M datasheet
3KBP08M General Description
3KBP005M thru 3KBP10M datasheet
3KBP08M Maximum Ratings
| PARAMETER |
SYMBOL |
3KBP005M |
3KBP01M |
3KBP02M |
3KBP04M |
3KBP06M |
3KBP08M |
UNIT |
| Maximum repetitive peak reverse voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
V |
| Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
V |
| Maximum DC blocking voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
V |
| Maximum average forward output rectified currentat TA = 55 (Fig. 1) |
IF(AV) |
3.0 |
A | |||||
| Peak forward surge current 50 Hz single half sine-wave superimposed on rated load |
IFSM |
80 |
A | |||||
| Rating for fusing (t < 10 ms) |
I2t |
32 |
A2s | |||||
| Operating junction and storage temperature range |
TJ, TSTG |
- 55 to + 150 |
||||||
3KBP08M Features
• UL recognition file number E54214
• Ideal for printed circuit board
• High surge current capability
• High case dielectric strength
• Solder dip 260, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
• Ideal for printed circuit board
• High surge current capability
• High case dielectric strength
• Solder dip 260, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
3KBP08M Typical Application
General purpose use in ac-to-dc bridge full wave rectification for switching power supply, home appliances, office equipment, and telecommunication applications.
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