33990, 339A, 339ARP Selling Leads, Datasheet
MFG:MOT Package Cooled:SOP8 D/C:04+
MFG:MOT Package Cooled:SOP8 D/C:04+
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PDF/DataSheet Download
Datasheet: 33981
File Size: 480868 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 33981
File Size: 480868 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 33981
File Size: 480868 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
The 33990 is a serial transceiver designed to provide bi-directional half-duplex communication meeting the automotive SAE Standard J-1850 Class B Data Communication Network Interface specification. It is designed to interface directly to on-board vehicle microcontrollers and serves to transmit and receive data on a single-wire bus at data rates of 10.4 kbps using Variable Pulse Width Modulation (VPWM). The 33990 operates directly from a vehicle's 12 V battery system and functions in a true logic fashion as an I/O interface between the microcontroller's 5.0 V CMOS logic level swings and the required 0 V to 7.0 V waveshaped signal swings of the bus. The bus output driver is short circuit current limited.
Rating | Symbol | Value | Unit |
VBAT DC Supply Voltage (1) | VBAT | -16 to 40 | V |
Input I/O Pins (2) | VI/O(CPU) | -0.3 to 7.0 | V |
BUS and LOAD Outputs | VBUS | -2.0 to 16 | V |
ESD Voltage Human Body Model (3) Machine Model (4) |
VESD1 VESD2 |
±2000 ±200 |
V |
Storage Temperature | TSTG | -65 to 150 | |
Operating Ambient Temperature | TA | -40 to 125 | |
Operating Junction Temperature | TJ | -40 to 150 | |
Peak Package Reflow Temperature During Reflow (5), (6) | TPPRT | Note 6. | |
Thermal Resistance (Junction-to-Ambient) | RJ-A | 180 | /W |
Notes
1.An external series diode must be used to provide reverse battery protection of the device.
2.SLEEP, TX, RX, and 4X/LOOP are normally connected to a microcontroller.
3.ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 ).
4.ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 ).
5.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
6.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak ackage Reflow Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all rderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.