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The 27-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for iniature applications. etc.
27-21/BHC-AN1P2/3C Maximum Ratings
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
Operating Temperature
Topr
-40~ +85
Storage Temperature
Tstg
-40~ +90
Electrostatic Discharge(HBM)
ESD
150
V
Power Dissipation
Pd
110
mW
Peak Forward Current (Duty 1/10 @1KHz)
IFP
100
mA
Soldering Temperature
Tsol
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec.
27-21/BHC-AN1P2/3C Features
Package in 8mm tape on 7diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb free The product itself will remain within RoHS compliant version
27-21/BHC-AN1P2/3C Typical Application
Automotive: backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol. General use.