Features: • Low current consumption : ICC = 4.0 mA TYP. @ VCC = 3.0 V• Supply voltage : VCC = 2.4 to 3.3 V• High efficiency : PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz PO (1 dB) = +1.5 dBm TYP. @ f = 1.9 GHz PO (1 dB) = +1.0 dBm TYP. @ f = 2.4 GHz• Power gain : GP = 13.5 dB T...
mPC8179TB: Features: • Low current consumption : ICC = 4.0 mA TYP. @ VCC = 3.0 V• Supply voltage : VCC = 2.4 to 3.3 V• High efficiency : PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz PO (1 dB) = +1...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
• Low current consumption : ICC = 4.0 mA TYP. @ VCC = 3.0 V
• Supply voltage : VCC = 2.4 to 3.3 V
• High efficiency : PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz PO (1 dB) = +1.5 dBm TYP. @ f = 1.9 GHz PO (1 dB) = +1.0 dBm TYP. @ f = 2.4 GHz
• Power gain : GP = 13.5 dB TYP. @ f = 1.0 GHz GP = 15.5 dB TYP. @ f = 1.9 GHz GP = 15.5 dB TYP. @ f = 2.4 GHz
• Excellent isolation : ISL = 44 dB TYP. @ f = 1.0 GHz ISL = 42 dB TYP. @ f = 1.9 GHz ISL = 41 dB TYP. @ f = 2.4 GHz
• Operating frequency : 0.1 to 2.4 GHz (Output port LC matching)
• High-density surface mounting : 6-pin super minimold package (2.0X 1.25X0.9 mm)
• Light weight : 7 mg (Standard value)
Parameter |
Symbol |
Conditions |
Ratings |
Unit |
Supply Voltage |
VCC |
TA = +25 , Pin 4, Pin 6 |
3.6 |
V |
Circuit Current |
ICC |
TA = +25 |
15 |
mA |
Power Dissipation |
PD |
Mounted on double sided copper clad 50 ´ 50 ´ 1.6 mm epoxy glass PWB (TA = +85 ) |
270 |
mW |
Operating Ambient Temperature |
TA |
-40 to +85 |
||
Storage Temperature |
Tstg |
-55 to +150 |
||
Input Power |
Pin |
TA = +25 |
+5 |
dBm |
The mPC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This mPC8179TB can realize low current consumption with external chip inductor which can not be realized on internal 50 wideband matched IC. This low current amplifier operates on 3.0 V.
This mPC8179TB is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, mPC8179TB has excellent performance, uniformity and reliability.