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HB56G132

Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 60 /70ns (max)· Low power dissipation -Active mode: 1.84/1.63 W (max) (HB56G232 Series) 1.79/1.58 W (...

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SeekIC No. : 004358931 Detail

HB56G132: Features: · 72-pin single in-line package -Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 6...

HB56G132 Data Sheet

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Part Number:
HB56G132
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 107.95 mm (Length) × 25.40 mm (Height) × 9.14/5.28 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 60 /70ns (max)
·  Low power dissipation
     - Active mode: 1.84/1.63 W (max) (HB56G232 Series)
     1.79/1.58 W (max) (HB56G132 Series)
     - Standby mode (TTL): 42 mW (max) (HB56G232 Series)
     (TTL): 21 mW (max) (HB56G132 Series)
     (CMOS): 3.15 mW (max) (L-version) (HB56G232 Series)
     (CMOS): 1.58 mW (max) (L-version) (HB56G132 Series)
·  Fast page mode capability
·  Refresh period
     - 1024 refresh cycles: 16 ms
     128 ms (L-version)


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
2
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56G232 is a 2M ×32 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM5118160) sealed in SOJ package. The HB56G132 is a 1M ×32 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM (HM5118160) sealed in SOJ package. An outline of the HB56G232, HB56G132 is 72-pin single in-line package. Therefore, they make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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