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HB56A1632

Features: · 72-pin single in-line package -Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max)· Low power dissipation -Active mode: 17.01/15.12/13.23 W (max) (HB56A1636 Series)15.12/13...

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SeekIC No. : 004358877 Detail

HB56A1632: Features: · 72-pin single in-line package -Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/7...

HB56A1632 Data Sheet

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Part Number:
HB56A1632
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
·  Low power dissipation
     - Active mode: 17.01/15.12/13.23 W (max) (HB56A1636 Series)
      15.12/13.44/11.76 W (max) (HB56A1632 Series)
     - Standby mode (TTL): 378 mW (max) (HB56A1636 Series)
       (TTL): 336 mW (max) (HB56A1632 Series)
       (CMOS): 189 mW (max) (HB56A1636 Series)
       (CMOS): 168 mW (max) (HB56A1632 Series)
·  Fast page mode capability
·  Refresh period
     - 4096 refresh cycles: 64 ms
·  3 variations of refresh
     - RAS -only refresh
     - CAS -before- RAS refresh
     - Hidden refresh
·  TTL compatible


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
36
W
Power dissipation (HB56A1636)
PT
32
W
Power dissipation (HB56A1632)
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A1636 is a 16M ×36 dynamic RAM module, mounted 36 pieces of 16-Mbit DRAM (HM5116100) sealed in SOJ package. The HB56A1632 is a 16M × 32 dynamic RAM module, mounted 32 pieces of 16-Mbit DRAM (HM5116100) sealed in SOJ package. An outline of the HB56A1636, HB56A1632 is 72-pin single in-line package. Therefore, the HB56A1636, HB56A1632 make high density mounting possible without surface mount technology. The HB56A1636, HB56A1632 provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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