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HB56A1636

Features: · 72-pin single in-line package -Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/70 ns (max)· Low power dissipation -Active mode: 17.01/15.12/13.23 W (max) (HB56A1636 Series)15.12/13...

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SeekIC No. : 004358878 Detail

HB56A1636: Features: · 72-pin single in-line package -Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 50/60/7...

HB56A1636 Data Sheet

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Part Number:
HB56A1636
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·  72-pin single in-line package
     - Outline: 115.57 mm (Length) ×36.195 mm (Height)× 9.10 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 50/60/70 ns (max)
·  Low power dissipation
     - Active mode: 17.01/15.12/13.23 W (max) (HB56A1636 Series)
      15.12/13.44/11.76 W (max) (HB56A1632 Series)
     - Standby mode (TTL): 378 mW (max) (HB56A1636 Series)
       (TTL): 336 mW (max) (HB56A1632 Series)
       (CMOS): 189 mW (max) (HB56A1636 Series)
       (CMOS): 168 mW (max) (HB56A1632 Series)
·  Fast page mode capability
·  Refresh period
     - 4096 refresh cycles: 64 ms
·  3 variations of refresh
     - RAS -only refresh
     - CAS -before- RAS refresh
     - Hidden refresh
·  TTL compatible


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
1.0 to +7.0
V
Supply voltage relative to VSS
VCC
1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
36
W
Power dissipation (HB56A1636)
PT
32
W
Power dissipation (HB56A1632)
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56A1636 is a 16M ×36 dynamic RAM module, mounted 36 pieces of 16-Mbit DRAM (HM5116100) sealed in SOJ package. The HB56A1632 is a 16M × 32 dynamic RAM module, mounted 32 pieces of 16-Mbit DRAM (HM5116100) sealed in SOJ package. An outline of the HB56A1636, HB56A1632 is 72-pin single in-line package. Therefore, the HB56A1636, HB56A1632 make high density mounting possible without surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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