Features: • RDS(on)=40m@VGS=2.5V, ID=5.2A; RDS(on)=30m@VGS=4.5V, ID=6A• High Density Cell Design for Ultra Low On-Resistance• High Power and Current Handing Capability• Fully Characterized Avalanche Voltage and Current• Ideal for Li ion Battery Pack ApplicationsApplic...
H9926CS: Features: • RDS(on)=40m@VGS=2.5V, ID=5.2A; RDS(on)=30m@VGS=4.5V, ID=6A• High Density Cell Design for Ultra Low On-Resistance• High Power and Current Handing Capability• Fully...
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Symbol | Parameter | Ratings | Units |
VDS | Drain-Source Voltage | 20 | V |
VGS | Gate-Source Voltage | ±12 | V |
ID | Drain Current (Continuous) | 6 | A |
IDM | Drain Current (Pulsed) *1 | 30 | A |
PD | Total Power Dissipation @TA=25oC | 2 | W |
PD | Total Power Dissipation @TA=75oC | 1.3 | W |
Tj, Tstg | Operating and Storage Temperature Range | -55 to +150 | °C |
RJA | Thermal Resistance Junction to Ambient*2 | 62.5 | °C/W |
This N-Channel 2.5V specified MOSFET is a rugged gate version of advanced trench process. H9926CS has been optimized for power management applications with a wide range of gate drive voltage (2.5V-10V)