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ZXMN2F30FH

Features: • Low on-resistance• 2.5V gate drive capability• SOT23 packageApplication• Buck/Boost DC-DC Converters• Load switching and SMPS• Charging applications in portable equipment• Motor Control• LED LightingPinoutSpecifications Part Number ...

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SeekIC No. : 004552484 Detail

ZXMN2F30FH: Features: • Low on-resistance• 2.5V gate drive capability• SOT23 packageApplication• Buck/Boost DC-DC Converters• Load switching and SMPS• Charging applications i...

ZXMN2F30FH Data Sheet

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Part Number:
ZXMN2F30FH
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Low on-resistance
• 2.5V gate drive capability
• SOT23 package




Application

• Buck/Boost DC-DC Converters
• Load switching and SMPS
• Charging applications in portable equipment
• Motor Control
• LED Lighting




Pinout

Connection Diagram




Specifications

Part Number ZXMN2F30FH
Config/
Polarity		 N
PD
(W)		 1.4
VDSS
(V)		 20
VGSS
(+/-)
(V)		 12
ID
(A)		 4.9
RDS(on) Max() @ VGS; 1.5V
RDS(on) Max() @ VGS; 1.8V
RDS(on) Max() @ VGS; 2.5V 0.065
RDS(on) Max() @ VGS; 2.7V
RDS(on) Max() @ VGS; 4.0V
RDS(on) Max() @ VGS; 4.5V 0.045
RDS(on) Max() @ VGS; 10.0V
VGS(th)
(V)		 0.6
Ciss (typ)
(pF)		 452
Qg (typ) (nC)
@ VGS; 4.5V		 4.8
Qg (typ) (nC)
@ VGS; 10V


Parameter Symbol Limit Unit
Drain source voltage VDDS 20 V
Gate source voltage VGS ±12 V
Continous Drain Current @ VGS=4.5; TA=25°C(b)
@ VGS=4.5; TA=70°C(b)
@ VGS=4.5; TA=25°C(a)		 ID 4.9
4.0
4.1		 A
A
A
Pulsed drain current(c) IDM 22.6 A
Continuous source current (body diode)(b) IS 1.6 A
Pulsed source current (body diode)(c) ISM 22.6 A
Power dissipation at TA =25°C(a)
Linear derating factor		 PD 0.96
7.6		 W
mW/
Power dissipation at TA =25°C(b)
Linear derating factor		 PD 1.4
11.2		 W
mW/
Operating and storage temperature range Tj, Tstg -55 to +150

NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t 5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s - pulse width limited by maximum junction temperature.
(d)Thermal resistance from junction to solder-point (at the end of the drain lead).






Description

This new generation Trench MOSFET ZXMN2F30FH from Zetex features low onresistance achievable with low (2.5V) gate drive.




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