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ZXMN10A25G

Features: • Low on-resistance• Fast switching speed• Low gate drive• SOT223 packageApplication• DC-DC converters• Power management functions• Disconnect switches• Motor controlPinoutSpecifications Parameter Symbol Limit Unit Drain-source v...

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SeekIC No. : 004552470 Detail

ZXMN10A25G: Features: • Low on-resistance• Fast switching speed• Low gate drive• SOT223 packageApplication• DC-DC converters• Power management functions• Disconnect swi...

ZXMN10A25G Data Sheet

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Part Number:
ZXMN10A25G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Low on-resistance
• Fast switching speed
• Low gate drive
• SOT223 package




Application

• DC-DC converters
• Power management functions
• Disconnect switches
• Motor control




Pinout

Connection Diagram




Specifications

Parameter Symbol Limit Unit
Drain-source voltage VDSS 100 V
Gate-source voltage VGS ± 20 V
Continuous drain current @ VGS= 10V; Tamb=25(b)
@ VGS= 10V; Tamb=70(b)
@ VGS= 10V; Tamb=25(a)		 ID 4
3.2
2.9		 A
Pulsed drain current(c) IDM 17 A
Continuous source current (body diode)(b) IS 5.4 A
Pulsed source current (body diode)(c) ISM 17 A
Power dissipation at Tamb =25(a)
Linear derating factor		 PD 2
16		 W
mW/
Power dissipation at Tamb =25(b)
Linear derating factor		 PD 3.9
31		 W
mW/
Operating and storage temperature range Tj, Tstg -55 to +150

NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still airconditions.
(b) For a device surface mounted on FR4 PCB measured at t 10 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s - pulse width limited by maximum junction temperature.




Description

This new generation trench MOSFET ZXMN10A25G from Zetex features a unique structure which combininthe benefits of low on-resistance and fast switching, making it ideal for high efficiency power management applications.






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