Features: • Glass Passivated chip junction• Low Zener Impedance• Excellent Clamping Capability• High temperature soldering guaranteed: 260/10 seconds• RoHS ComplianceSpecifications Symbol Description Value Unit Conditions Ptot Power dissipation ...
Z1SMA3V3: Features: • Glass Passivated chip junction• Low Zener Impedance• Excellent Clamping Capability• High temperature soldering guaranteed: 260/10 seconds• RoHS ComplianceSp...
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Symbol | Description |
Value |
Unit |
Conditions |
Ptot | Power dissipation |
1.0 |
W |
Ta=25 |
Ptot | Power dissipation |
3.0 |
W |
Ta=25, RthJA= 25/ W |
TJ,TSTG | Operating Junction and Storage Temperature Range |
-65 to 175 |
||
VF | Max. Forward Voltage drop |
1.0 |
V |
IF=0.5A |
RthJC | Typical Thermal Resistance |
25 |
/W |
|
RthJA | PCB epoxy-glass path 1.5mm PCB epoxy-glass path 5 x 10mm Ceramic Plate (Al2O3) path 5 x 10mm |
150 125 100 |
/W /W /W |