XM28C010P

The XM28C010P is a high speed, high density CMOS byte alterable nonvolatile memory array constructed on a co-fired ceramic substrate using Xicor's High Speed 32K x 8 components in 32-pad leadless chip carriers. The Substrate is a 66-pin ceramic pin grid array. The XM28C010P is configured with four separate chip enable and write enable inputs and 32 separate I/Os. This, along with the small footprint, provides the end user with a large degree of flexibility in board layout and memory configuration. In addition, with the large number of pins and the growth path being implemented, the module will be able to grow to 16 megabits.