Features: • High-performance XC800 Core compatible with standard 8051 processor two clocks per machine cycle architecture (for memory access without wait state) two data pointers• On-chip memory 12 Kbytes of Boot ROM 256 bytes of RAM 1.5 Kbytes of XRAM 24/32 Kbytes of Flash; or 24/32 K...
XC886CLM: Features: • High-performance XC800 Core compatible with standard 8051 processor two clocks per machine cycle architecture (for memory access without wait state) two data pointers• On-chi...
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• High-performance XC800 Core
compatible with standard 8051 processor
two clocks per machine cycle architecture (for memory access without wait state)
two data pointers
• On-chip memory
12 Kbytes of Boot ROM
256 bytes of RAM
1.5 Kbytes of XRAM
24/32 Kbytes of Flash; or 24/32 Kbytes of ROM, with additional 4 Kbytes of Flash (includes memory protection strategy)
• I/O port supply at 3.3 V or 5.0 V and core logic supply at 2.5 V (generated by embedded voltage regulator)
• Power-on reset generation
• Brownout detection for core logic supply
• On-chip OSC and PLL for clock generation
PLL loss-of-lock detection
• Power saving modes
slow-down mode
idle mode
power-down mode with wake-up capability via RXD or EXINT0
clock gating control to each peripheral
• Programmable 16-bit Watchdog Timer (WDT)
• Six ports
34/48 pins as digital I/O
8 pins as digital/analog input
• 8-channel, 10-bit ADC
• Four 16-bit timers
Timer 0 and Timer 1 (T0 and T1)
Timer 2 and Timer 21
• Multiplication/Division Unit for arithmetic operations (MDU)
• CORDIC Coprocessor for computation of trigonometric, hyperbolic and linear functions
• MultiCAN with 2 nodes, 32 message objects (MCAN)
• Capture/compare unit for PWM signal generation (CCU6)
• Two full-duplex serial interfaces (UART and UART1)
• Synchronous serial channel (SSC)
• On-chip debug support
1 Kbyte of monitor ROM (part of the 12-Kbyte Boot ROM)
64 bytes of monitor RAM
• Packages:
PG-TQFP-48
PG-TQFP-64
• Temperature range TA:
SAF (-40 to 85 °C)
SAK (-40 to 125 °C)
Parameter |
Symbol |
Min. |
Max. |
Unit |
Notes |
Ambient temperature |
TA |
-40 |
125 |
°C |
under bias |
Storage temperature |
TST |
-65 |
150 |
°C |
|
Junction temperature |
TJ |
-40 |
150 |
°C |
under bias |
Voltage on power supply pin with respect to VSS |
VDDP |
-0.5 |
6 |
V |
|
Input current on any pin during overload condition |
IIN |
-10 |
10 |
mA |
|
Absolute sum of all input currents during overload condition |
|IIN| |
- |
tbd |
mA |
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pin with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings.