XC3S200AN-4FTG256C

IC SPARTAN-3AN FPGA 200K 256FTBG

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SeekIC No. : 003506496 Detail

XC3S200AN-4FTG256C: IC SPARTAN-3AN FPGA 200K 256FTBG

floor Price/Ceiling Price

US $ 10.54~10.54 / Piece | Get Latest Price
Part Number:
XC3S200AN-4FTG256C
Mfg:
Supply Ability:
5000

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  • Qty
  • 0~1
  • Unit Price
  • $10.54
  • Processing time
  • 15 Days
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Upload time: 2024/12/21

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Product Details

Quick Details

Series: Spartan®-3AN Manufacturer: Xilinx Inc
Number of LABs/CLBs: 448 Number of Logic Elements/Cells: 4032
Total RAM Bits: 294912 Number of I /O: 195
Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount Maximum Power Dissipation : 0.62 W
Operating Temperature: 0°C ~ 85°C Package / Case: 256-LBGA    

Description

Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 256-LBGA
Total RAM Bits: 294912
Number of I /O: 195
Manufacturer: Xilinx Inc
Supplier Device Package: 256-FTBGA
Series: Spartan®-3AN
Number of LABs/CLBs: 448
Number of Logic Elements/Cells: 4032
Number of Gates: 200000


Description

 

The XC3S200AN-4FTG256C is one member of the Sparta-3 family of field-programmable gate arrays. This family is programmed by loading configuration
data into robust static memory cells that collectively control all functional elements and routing resources. Also it builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions.

Features of the XC3S200AN-4FTG256C are:(1)revolutionary 90-nanometer process technology;(2)very low cost, high-performance logic solution for high-volume, consumer-oriented applications;(3)622 Mb/s data transfer rate per I/O;(4)seventeen single-ended signal standards;(5)termination by digitally controlled impedance;(6)abundant logic cells with shift register capability;(7)fast look-ahead carry logic;(8)JTAG logic compatible with IEEE 1149.1/1532 specifications;(9)eight global clock lines and abundant routing;(10)microBlaze processor, PCI, and other cores;(11)fully supported by Xilinx ISE development system--synthesis, mapping, placement and routing.

The absolute maximum ratings of the XC3S200AN-4FTG256C can be summarized as:(1)internal supply voltage:-0.5 to 1.32 V;(2)auxiliary supply voltage:-0.5 to 3.00 V;(3)output driver supply voltage:-0.5 to 3.75 V;(4)input reference voltage:-0.5 to Vcco+0.5 V;(5)junction temperature (VCCO < 3.0V):125 °C;(6)junction temperature (VCCO > 3.0V):105 °C;(7)soldering temperature:220 °C;(8)storage temperature:-65 to 150 °C. If you want to know more information such as the electrical characteristics about the XC3S200AN-4FTG256C, please download the datasheet in www.seekic.com or www.chinaicmart.com .




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