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XC3S1000

Features: • Low-cost, high-performance logic solution for high-volume, consumer-oriented applications - Densities up to 74,880 logic cells• SelectIO™ signaling - Up to 784 I/O pins - 622 Mb/s data transfer rate per I/O - 18 single-ended signal standards - 8 differential I/O stand...

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SeekIC No. : 004547832 Detail

XC3S1000: Features: • Low-cost, high-performance logic solution for high-volume, consumer-oriented applications - Densities up to 74,880 logic cells• SelectIO™ signaling - Up to 784 I/O pins...

XC3S1000 Data Sheet

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Part Number:
XC3S1000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

• Low-cost, high-performance logic solution for high-volume, consumer-oriented applications
   - Densities up to 74,880 logic cells
• SelectIO™ signaling
   - Up to 784 I/O pins
   - 622 Mb/s data transfer rate per I/O
   - 18 single-ended signal standards
   - 8 differential I/O standards including LVDS, RSDS
   - Termination by Digitally Controlled Impedance
   - Signal swing ranging from 1.14V to 3.45V
   - Double Data Rate (DDR) support
   - DDR, DDR2 SDRAM support up to 333 Mbps
• Logic resources
   - Abundant logic cells with shift register capability
   - Wide, fast multiplexers
   - Fast look-ahead carry logic
   - Dedicated 18 x 18 multipliers
   - JTAG logic compatible with IEEE 1149.1/1532
• SelectRAM™ hierarchical memory
   - Up to 1,872 Kbits of total block RAM
   - Up to 520 Kbits of total distributed RAM
• Digital Clock Manager (up to four DCMs)
   - Clock skew elimination
   - Frequency synthesis
   - High resolution phase shifting
• Eight global clock lines and abundant routing
• Fully supported by Xilinx ISE development system
   - Synthesis, mapping, placement and routing
• MicroBlaze™ processor, PCI, and other cores
• Pb-free packaging options
• Low-power Spartan-3L Family and Automotive Spartan-3 XA Family variants


Specifications

Symbol Description Conditions Min Max Units
VESD Electrostatic Discharge Voltage pins relative to GND Human body model XC3S50 - ±1500 V
Other - ±2000 V
Charged device model - ±500 V
Machine model - ±200 V
TJ Junction temperature - 125
TSOL Soldering temperature - 220
TSTG Storage temperature -65 150



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