XC3S1000-4FTG256I

Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Package / Case: 256-LBGA
Number of I /O: 173
Number of Gates: 1000000
Manufacturer: Xilinx Inc
Supplier Device Package: 256-FTBGA
Series: Spartan®-3
Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368


Description

The XC3S1000-4FTG256I is one member of the Spartan-3 FPGA family that builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions.

Features of the XC3S1000-4FTG256I are:(1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Up to 784 I/O pins; (4)622 Mb/s data transfer rate per I/O; (5)Seventeen single-ended signal standards; (6)Seven differential signal standards including LVDS; (7)Termination by Digitally Controlled Impedance; (8)Eight global clock lines and abundant routing; (9)Fully supported by Xilinx ISE development system - Synthesis, mapping, placement and routing; (10)MicroBlaze processor, PCI, and other cores.

The absolute maximum ratings of the XC3S1000-4FTG256I can be summarized as:(1)Internal supply voltage: -0.5 to 1.32 V;(2)Auxiliary supply voltage: -0.5 to 3.00 V;(3)Output driver supply voltage: -0.5 to 3.75 V;(4)Input reference voltage: -0.5 to VCCO+0.5 V;(5)Junction temperature: 125 °C;(6)Soldering temperature: 220 °C;(7)Storage temperature: -65 to 150 °C. If you want to know more information such as the electrical characteristics about the XC3S1000-4FTG256I, please download the datasheet in www.seekic.com or www.chinaicmart.com.