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WSF512K32-29H2X

Features: · Access Times of 25ns (SRAM) and 70, 90ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, Hermetic Ceramic HIP (Package 402)• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 ) square (Package 509) 4.57mm (0.180 ) height. Designed to fi t JEDEC 68 lead 0.990 CQFJ footpr...

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SeekIC No. : 004546763 Detail

WSF512K32-29H2X: Features: · Access Times of 25ns (SRAM) and 70, 90ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, Hermetic Ceramic HIP (Package 402)• 68 lead, Hermetic CQFP (G2T), 22.4mm (0....

WSF512K32-29H2X Data Sheet

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Part Number:
WSF512K32-29H2X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

· Access Times of 25ns (SRAM) and 70, 90ns (FLASH)
· Packaging
• 66 pin, PGA Type, 1.385" square HIP, Hermetic Ceramic HIP (Package 402)
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height. Designed to fi t JEDEC 68 lead 0.990" CQFJ footprint (Figure 2). Package to be developed.
· 512Kx32 SRAM
· 512Kx32 5V Flash
· Organized as 512Kx32 of SRAM and 512Kx32 of Flash Memory with common Data Bus
· Low Power CMOS
· Commercial, Industrial and Military Temperature Ranges
· TTL Compatible Inputs and Outputs
· Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
· Weight - 13 grams typical


Pinout

Connection Diagram


Specifications

Parameter Symbol Min Max Unit
Operating Temperature TA -55 +125
Storage Temperature TSTG -65 +150
Signal Voltage Relative to GND VG -0.5 7.0 V
Junction Temperature TJ 150
Supply Voltage VCC -0.5 7.0 V



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