Features: Access Times of 35ns (SRAM) and 70ns (FLASH)Access Times of 70ns (SRAM) and 120ns (FLASH)Packaging• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)• 66-pin, PGA Type, 1.185 inch square HIP, Hermetic Ceramic HIP (Package 401)• 68 lead, Hermeti...
WSF128K16: Features: Access Times of 35ns (SRAM) and 70ns (FLASH)Access Times of 70ns (SRAM) and 120ns (FLASH)Packaging• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)•...
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DescriptionThe WSF128K16-72 is designed as one kind of 128K x 32 SRAM / flash module. Features of ...
Features: ` Access Times of 35ns (SRAM) and 70ns (FLASH)` Access Times of 70ns (SRAM) and 120ns (F...
Access Times of 35ns (SRAM) and 70ns (FLASH)
Access Times of 70ns (SRAM) and 120ns (FLASH)
Packaging
• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)
• 66-pin, PGA Type, 1.185 inch square HIP, Hermetic Ceramic HIP (Package 401)
• 68 lead, Hermetic CQFP (G1U), 22.4mm (0.880 inch) square (Package 519). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 2)
128Kx16 SRAM
128Kx16 5V FLASH
Organized as 128Kx16 of SRAM and 128Kx16 of Flash Memory with separate Data Buses
Both blocks of memory are User Configurable as 256Kx8
Low Power CMOS
Commercial, Industrial and Military Temperature Ranges
TTL Compatible Inputs and Outputs
Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
Weight
• WSF128K16-XHX - 13 grams typical
• WSF128K16-H1X - 13 grams typical
• WSF128K16-XG1UX - 5 grams typical
PARAMETER | Symble | MIN | MAX | UNIT |
Operating Temperature | TA | -55 | +125 | °C |
Storage Temperature | TSTG | -65 | +150 | °C |
Signal Voltage Relative to GND | VG | -0.5 | 7.0 | V |
Junction Temperature | TJ | 150 | °C | |
Supply Voltage | VCC | -0.5 | 7.0 | V |