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WSF128K16

Features: Access Times of 35ns (SRAM) and 70ns (FLASH)Access Times of 70ns (SRAM) and 120ns (FLASH)Packaging• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)• 66-pin, PGA Type, 1.185 inch square HIP, Hermetic Ceramic HIP (Package 401)• 68 lead, Hermeti...

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SeekIC No. : 004546754 Detail

WSF128K16: Features: Access Times of 35ns (SRAM) and 70ns (FLASH)Access Times of 70ns (SRAM) and 120ns (FLASH)Packaging• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)•...

WSF128K16 Data Sheet

floor Price/Ceiling Price

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Part Number:
WSF128K16
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

 Access Times of 35ns (SRAM) and 70ns (FLASH)
 Access Times of 70ns (SRAM) and 120ns (FLASH)
 Packaging
• 66-pin, PGA Type, 1.075 inch square HIP, Hermetic Ceramic HIP (Package 400)
• 66-pin, PGA Type, 1.185 inch square HIP, Hermetic Ceramic HIP (Package 401)
• 68 lead, Hermetic CQFP (G1U), 22.4mm (0.880 inch) square (Package 519). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 2)
 128Kx16 SRAM
 128Kx16 5V FLASH
 Organized as 128Kx16 of SRAM and 128Kx16 of Flash Memory with separate Data Buses
 Both blocks of memory are User Configurable as 256Kx8
 Low Power CMOS
 Commercial, Industrial and Military Temperature Ranges
 TTL Compatible Inputs and Outputs

 Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
 Weight
• WSF128K16-XHX - 13 grams typical
• WSF128K16-H1X - 13 grams typical
• WSF128K16-XG1UX - 5 grams typical




Pinout

Connection Diagram




Specifications

PARAMETER Symble MIN MAX UNIT
Operating Temperature TA -55 +125 °C
Storage Temperature TSTG -65 +150 °C
Signal Voltage Relative to GND VG -0.5 7.0 V
Junction Temperature TJ   150 °C
Supply Voltage VCC -0.5 7.0 V



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