WED2DL36513V

Features: · Fast clock speed: 200, 166, 150 & 133MHz· Fast access times: 2.5ns, 3.5ns, 3.8ns & 4.0ns· Fast OE access times: 2.5ns, 3.5ns, 3.8ns 4.0ns· Available with 1.5ns setup and 0.5ns hold times or 1.0ns setup and hold times.· Single +3.3V power supply (VDD)· Seperate +3.3V or +2.5V is...

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WED2DL36513V Picture
SeekIC No. : 004545546 Detail

WED2DL36513V: Features: · Fast clock speed: 200, 166, 150 & 133MHz· Fast access times: 2.5ns, 3.5ns, 3.8ns & 4.0ns· Fast OE access times: 2.5ns, 3.5ns, 3.8ns 4.0ns· Available with 1.5ns setup and 0.5ns ho...

floor Price/Ceiling Price

Part Number:
WED2DL36513V
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

· Fast clock speed: 200, 166, 150 & 133MHz
· Fast access times: 2.5ns, 3.5ns, 3.8ns & 4.0ns
· Fast OE access times: 2.5ns, 3.5ns, 3.8ns 4.0ns
· Available with 1.5ns setup and 0.5ns hold times or 1.0ns setup and hold times.
· Single +3.3V power supply (VDD)
· Seperate +3.3V or +2.5V isolated output buffer supply (VDDQ)
· Snooze Mode for reduced-power standby
· Single-cycle deselect
· Common data inputs and data outputs
· Individual Byte Write control and Globa Write
· Clock-controlled and registered addresses, data I/Os and control signals
· Burst control (interleaved or linear burst)
· Packaging:  119-bump BGA package
· Low capacitive bus loading
· Available in either single CE or three CE configuration
· IEEE 1149.1 JTAG Compatible Boundary Scan (available on single CE version only)



Specifications

Voltage on VDD Supply relative to VSS

Voltage on VDDQ Supply relative to VSS

VIN (DQx)

VIN (Inputs)

Storage Temperature (BGA)

Short Circuit Output Current
-0.5V to +4.6V

-0.5V to +4.6V

-0.5V to VDDQ +0.5V

-0.5V to VDD +0.5V

+55°C to +125°C

100 mA

*Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.




Description

The WEDC SyncBurst - SRAM family of the WED2DL36513V employs high-speed, lowpower CMOS designs that are fabricated using an advanced CMOS process. WEDC's 16Mb SyncBurst SRAMs integrate two 512K x 18 SRAMs into a single BGA package to provide 512K x 36 configuration. All synchronous inputs pass through registers controlled by a positive - edge-triggered single-clock input (CLK).

The synchronous inputs of the WED2DL36513V include all addresses, all data inputs, active LOW chip enable (CE), burst control inputs (ADSC, ADSP, ADV), byte write enables (BW0-3) and global write (GW). Asynchronous inputs include the output enable (OE), clock (CLK) and snooze enable (ZZ). There is also a burst mode input (MODE) that selects between interleaved and linear burst modes. Write Cycles can be from one to four bytes wide, as  ontrolled by the write control inputs. Burst operation can be initiated with either address status processor (ADSP) or address status controller (ADSC) inputs. Subsequent burst addresses of the WED2DL36513V can be internally generated as controlled by the burst advance input (ADV).




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