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WE128K32-XXX

Features: ` Access Times of 120**, 140, 150, 200, 250, 300ns` Packaging:-66-pin, PGA Type, 27.3mm (1.075 ) square, Hermetic Ceramic HIP (Package 400)-68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180 ) high, (Package 509)`Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8` Write Endurance 1...

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SeekIC No. : 004545528 Detail

WE128K32-XXX: Features: ` Access Times of 120**, 140, 150, 200, 250, 300ns` Packaging:-66-pin, PGA Type, 27.3mm (1.075 ) square, Hermetic Ceramic HIP (Package 400)-68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180 ) ...

WE128K32-XXX Data Sheet

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Part Number:
WE128K32-XXX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

` Access Times of 120**, 140, 150, 200, 250, 300ns
` Packaging:
-66-pin, PGA Type, 27.3mm (1.075") square, Hermetic Ceramic HIP (Package 400)
-68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180") high, (Package 509)
`Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8
` Write Endurance 10,000 Cycles
`Data Retention Ten Years Minimum (at +25)
` Commercial, Industrial and Military Temperature Ranges
` Low Power CMOS
` Automatic Page Write Operation
` Page Write Cycle Time: 10ms Max
` Data Polling for End of Write Detection
` Hardware and Software Data Protection
` TTL Compatible Inputs and Outputs
`5 Volt Power Supply
` Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
`Weight
-WE128K32-XG2TX - 8 grams typical
-WE128K32-XH1X - 13 grams typical


Pinout

Connection Diagram


Specifications

Parameter Symbol   Unit
Operating Temperature TA -55 to +125
Storage Temperature TSTG -65 to +150
Signal Voltage Relative to GND VG -0.6 to + 6.25 V
Voltage on OE# and A9   -0.6 to +13.5 V
NOTE:
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of
this specifi cation is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.


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