WCMC8016V9X

Features: • Wide voltage range: 2.70V3.30V• Access Time: 70ns• Ultra-low active power- Typical active current: 2.0mA @ f = 1 MHz- Typical active current: 11mA @ f = fmax• Ultra low standby power• Easy memory expansion with CE, CE2, and OE features• Automatic pow...

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SeekIC No. : 004545480 Detail

WCMC8016V9X: Features: • Wide voltage range: 2.70V3.30V• Access Time: 70ns• Ultra-low active power- Typical active current: 2.0mA @ f = 1 MHz- Typical active current: 11mA @ f = fmax• Ult...

floor Price/Ceiling Price

Part Number:
WCMC8016V9X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/7/26

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Product Details

Description



Features:

• Wide voltage range: 2.70V3.30V
• Access Time: 70ns
• Ultra-low active power
- Typical active current: 2.0mA @ f = 1 MHz
- Typical active current: 11mA @ f = fmax
• Ultra low standby power
• Easy memory expansion with CE, CE2, and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Offered in a 48 Ball BGA Package





Specifications

(Above which the useful life may be impaired. For user guidelines,
not tested.)
Storage Temperature ...................................... 65 to + 150
Ambient Temperature with
Power Applied ................................................... 55 to + 85
Supply Voltage to Ground Potential ..................... 0.4V to 4.6V

DC Voltage Applied to Outputs
in High Z State[5, 6, 7] .........................................0.2V to 3.3V
DC Input Voltage[5, 6, 7] .....................................0.2V to 3.3V
Output Current into Outputs (LOW)..................................20 mA
Static Discharge Voltage ............................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current ..........................................................>200 mA
Notes:
5. VIH(MAX) = VCC + 0.5V for pulse durations less than 20ns.
6. VIL(MIN) = -0.5V for pulse durations less than 20ns.
7. Overshoot and undershoot specifications are characterized and are not 100% tested.
8. Typical values are included for reference only and are not guranteed or tested. Typical values are measured at VCC = VCC (typ) and TA = 25C
9. VCC must be at minimal operational levels before inputs are turned ON.





Description

static RAM organized as 512K words by 16 bits that supports an asynchronous memory interface. This device features advanced circuit design to provide ultra-low active current. The WCMC8016V9X is ideal for providing More Battery Life® (MoBL®) in portable applications such as cellular telephones. The device can be put into standby mode reducing power consumption by more than 99% when deselected using CE LOW, CE2 HIGH or both BHE and BLE are HIGH. The input/output pins (I/O0 through I/O15) of WCMC8016V9X are placed in a high-impedance state when: deselected (CE HIGH, CE2 LOW OE is deasserted HIGH), or during a write operation (Chip Enabled and Write Enable WE LOW). The WCMC8016V9X also has an automatic power-down feature that significantly reduces power consumption by 99% when addresses are not toggling even when the chip is selected (Chip Enable CE LOW, CE2 HIGH and both BHE and BLE are LOW). Reading from the device is accomplished by asserting the Chip Enables (CE LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the Truth Table for a complete description of read and write modes






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