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WCMC2016V1X

Specifications Mfg Part Number: GC2016V5A Substrate Connection Req.: Ground Die Part Number: Wafer Diameter [mm]: 200.00 Die Technology: PowerChip 0.165 µm Die Size [µm]: 4010.74 x 1565.84 Metal I: 420 nm TiN/AlCu Step Size [µ...

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SeekIC No. : 004545479 Detail

WCMC2016V1X: Specifications Mfg Part Number: GC2016V5A Substrate Connection Req.: Ground Die Part Number: Wafer Diameter [mm]: 200.00 Die Technology: PowerChip 0.165 µm...

WCMC2016V1X Data Sheet

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Part Number:
WCMC2016V1X
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Specifications

Mfg Part Number:

 GC2016V5A

Substrate Connection Req.:

Ground

Die Part Number:

 

Wafer Diameter [mm]:

200.00

Die Technology:

PowerChip 0.165 µm

Die Size [µm]:

4010.74 x 1565.84

Metal I:

420 nm TiN/AlCu

Step Size [µm]:

4095.44 x 1650.89

Metal II:

880 nm TiN/Ti/AlCu/TiN

Scribe Size [µm]:

84.70 x 84.94

Metal III:

None

Pad Count:

64

Die Passivation:

 780nm P-Si3N4 + Polyimide

Pad Size [µm]:

73.6 x 73.6




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