W7MG1M32SVx70BNI Selling Leads, Price trend, W7MG1M32SVx70BNI DataSheet download, circuit diagram from SeekIC.com

Features: ` 1Mx32 and 2x1Mx32 Densities` Based on AMD - AM29LV160M Flash Device` Spansion™ - S29AL016M (optional)` High Performance • Access time as fast as 70ns • 0.7s typical sector erase time` 3V for read, erase, and program operations` Flexible, Sector Architecture • On...

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SeekIC No. : 004545067 Detail

W7MG1M32SVx70BNI: Features: ` 1Mx32 and 2x1Mx32 Densities` Based on AMD - AM29LV160M Flash Device` Spansion™ - S29AL016M (optional)` High Performance • Access time as fast as 70ns • 0.7s typical sec...

W7MG1M32SVx70BNI Data Sheet

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Part Number:: W7MG1M32SVx70BNI
Supply Ability:: 5000

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1~5000

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15 Days

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Upload time: 2024/11/20

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Product Details

Description

Features:

` 1Mx32 and 2x1Mx32 Densities
` Based on AMD - AM29LV160M Flash Device
` Spansion™ - S29AL016M (optional)
` High Performance
   • Access time as fast as 70ns
   • 0.7s typical sector erase time
` 3V for read, erase, and program operations
` Flexible, Sector Architecture
   • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors.
   • Any combination of sectors can be erased
   • Also supports full chip erase
` Top boot block conﬁ gurations
   • Bottom boot block optional. Contact WEDC.
` Embedded Erase Algorithms
    • Automatically preprograms and erases the chip or any combination of sectors
` Embedded Program Algorithms
    • Automatically programs and veriﬁ es data at speciﬁ ed ad dress
` Data Polling and Toggle Bit feature for detection of pro gram or erase cycle completion
` Low Power Dissipation
   • 30mA per Device Active Current
   • 10µA per Device CMOS Standby Current
`Single 3.3V ±10% Supply
` CMOS and TTL Compatible Inputs and Outputs
` Commercial and industrial operating temperature range
    • BNC = 0 to 70 Commercial
    • BNI = -40 to 85 Industrial
` Package
   • 80 Pin SIMM (JEDEC) Standard

Specifications

Storage Temperature
Plastic Packages ...................................65 to +150
Ambient Temperature
with Power Applied ...............................65 to +125
Voltage with Respect to Ground
V_CC (Note 1) ....................................... 0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2) ......... 0.5 V to +12.5 V
All other pins (Note 1) ................... 0.5 V to V_CC+0.5 V
Output Short Circuit Current (Note 3) .................200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is 0.5 V. During voltage transitions, input or I/O pins may
    overshoot V_SS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or
    I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to V_CC +2.0 V for
    periods up to 20ns. See Figure 8.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#,
    and RESET# may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input
    voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be
    greater than one second.

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.

Description

The W7MG1M32SVx-BN and W7MG21M32SVx-BN are or ga nized as one and two banks of 1Mx32 re spec tive ly. The modules are based on AMDs MirrorBit™ AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mount ed on an FR4 sub strate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed mi cro pro ces sors without wait states.

W7MG1M32SVx70BNI

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