W7MG1M32SV

Features: 1Mx32 and 2x1Mx32 DensitiesBased on AMD - AM29LV160M Flash DeviceSpansion™ - S29AL016M (optional)High Performance• Access time as fast as 70ns• 0.7s typical sector erase time3V for read, erase, and program operationsFlexible, Sector Architecture• One 16Kbyte, two ...

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SeekIC No. : 004545063 Detail

W7MG1M32SV: Features: 1Mx32 and 2x1Mx32 DensitiesBased on AMD - AM29LV160M Flash DeviceSpansion™ - S29AL016M (optional)High Performance• Access time as fast as 70ns• 0.7s typical sector erase ...

floor Price/Ceiling Price

Part Number:
W7MG1M32SV
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

1Mx32 and 2x1Mx32 Densities
Based on AMD - AM29LV160M Flash Device
Spansion™ - S29AL016M (optional)
High Performance
• Access time as fast as 70ns
• 0.7s typical sector erase time
3V for read, erase, and program operations
Flexible, Sector Architecture
• One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors.
• Any combination of sectors can be erased
• Also supports full chip erase
Top boot block confi gurations
• Bottom boot block optional. Contact WEDC.
Embedded Erase Algorithms
• Automatically preprograms and erases the chip or any combination of sectors
Embedded Program Algorithms
• Automatically programs and verifi es data at specifi ed ad dress
Data Polling and Toggle Bit feature for detection of pro gram or erase cycle completion
Low Power Dissipation
• 30mA per Device Active Current
• 10µA per Device CMOS Standby Current
Single 3.3V ±10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and industrial operating temperature range
• BNC = 0°C to 70°C Commercial
• BNI = -40°C to 85°C Industrial
Package
• 80 Pin SIMM (JEDEC) Standard
* This product is under development, is not qualifi ed or characterized and is subject to
change without notice.



Specifications

Storage Temperature
Plastic Packages .................................65°C to +150°C
Ambient Temperature
with Power Applied ............................65°C to +125°C
Voltage with Respect to Ground
VCC (Note 1) ......................................... 0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2) ........... 0.5 V to +12.5 V
All other pins (Note 1) .................... 0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) ..................200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is 0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.




Description

The W7MG1M32SVx-BN and W7MG21M32SVx-BN are or ga nized as one and two banks of 1Mx32 re spec tive ly. The modules are based on AMDs MirrorBit™ AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mount ed on an FR4 sub strate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed mi cro pro ces sors without wait states.




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