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W7G1M32SVx90BNC

Features: • 1Mx32 and 2x1Mx32 Densities• Based on AMD AM29LV160DT Flash Device• STs M29W160ET (optional)• Fast Read Access Time 70ns• 3.3V Only Reprogramming• Flexible, Sector Architecture • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sec...

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SeekIC No. : 004545061 Detail

W7G1M32SVx90BNC: Features: • 1Mx32 and 2x1Mx32 Densities• Based on AMD AM29LV160DT Flash Device• STs M29W160ET (optional)• Fast Read Access Time 70ns• 3.3V Only Reprogramming• F...

W7G1M32SVx90BNC Data Sheet

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Part Number:
W7G1M32SVx90BNC
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• 1Mx32 and 2x1Mx32 Densities
• Based on AMD AM29LV160DT Flash Device
• STs M29W160ET (optional)
• Fast Read Access Time 70ns
• 3.3V Only Reprogramming
• Flexible, Sector Architecture
   • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors.
   • Any combination of sectors can be erased
   • Also supports full chip erase
• Top boot block confi gurations
   • Bottom boot block optional. Contact WEDC.
• Embedded Erase Algorithms
   • Automatically preprograms and erases the chip or any combination of sectors
• Embedded Program Algorithms
   • Automatically programs and verifi es data at specifi ed ad dress
• Data Polling and Toggle Bit feature for detection of pro gram or erase cycle completion
• Low Power Dissipation
   • 30mA per Device Active Current
   • 10µA per Device CMOS Standby Current
• Single 3.3V ±10% Supply
• CMOS and TTL Compatible Inputs and Outputs
• Commercial and industrial operating temperature range
   • BNC = 0 to 70 Commercial
   • BNI = -40 to 85 Industrial
• Package
   • 80 Pin SIMM (JEDEC) Standard




Specifications

Storage Temperature
Plastic Packages ...................................65 to +150
Ambient Temperature
with Power Applied ...............................65 to +125
Voltage with Respect to Ground
VCC (Note 1) ........................................ 0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2) .......... 0.5 V to +12.5 V
All other pins (Note 1) .................... 0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) ..................200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is 0.5 V. During voltage transitions, input or I/O pins may
    overshoot  VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or
    I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for
    periods up to 20 ns. See Figure 8.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#,
    and RESET# may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input
    voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not
    be greater than one second.
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.


Description

The W7G1M32SVx-BN and W7G21M32SVx-BN are or ga nized as one and two banks of 1Mx32 re spec tive ly. The modules are based on AMDs AM29LV160DT - 1Mx16 or STs M29W160ET (optional) Flash device in TSOP packages which are mount ed on an FR4 sub strate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed mi cro pro ces sors without wait states.




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