Features: Double-data-rate architecture DDR200 and DDR266• JEDEC design specifi cations Bi-directional data strobes (DQS) Differential clock inputs (CK & CK#) Programmable Read Latency 2,2,5 (clock) Programmable Burst Length (2,4,8) Programmable Burst type (sequential & interleave) ...
W3EG6418S-D3: Features: Double-data-rate architecture DDR200 and DDR266• JEDEC design specifi cations Bi-directional data strobes (DQS) Differential clock inputs (CK & CK#) Programmable Read Latency 2,...
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Features: • Double-data-rate architecture• DDR200, DDR266, DDR333 and DDR400• JE...
Features: • Double-data-rate architecture• DDR200, DDR266, DDR333 and DDR400• JE...
Features: • Double-data-rate architecture• DDR200, DDR266, DDR333 and DDR400• JE...
Parameter |
Symbol |
Value |
Units |
Voltage on any pin relative to VSS |
VIN, VOUT |
-0.5 to 3.6 |
V |
Voltage on VCC supply relative to VSS |
VCC, VCCQ |
-1.0 to 3.6 |
V |
Storage Temperature |
TSTG |
-55 to +150 | |
Power Dissipation |
PD |
8 |
W |
Short Circuit Current |
IOS |
50 |
mA |
The W3EG6418S-D3 is a 16Mx64 Double Data Rate SDRAM memory module based on 128Mb DDR SDRAM components. The W3EG6418S-D3 consists of eight 16Mx8 DDR SDRAMs in 66 pin TSOP package mounted on a 184 Pin FR4 substrate.
Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges and Burst Lenths allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.