W3E32M64S-XBX

Features: DDR SDRAM rate = 200, 250, 266, 333Mb/sPackage:• 219 Plastic Ball Grid Array (PBGA),25mm x 25mm, 625mm22.5V ±0.2V core power supply2.5V I/O (SSTL_2 compatible)Differential clock in puts (CK and CK#)Commands entered on each positive CK edgeInternal pipelined double-data-rate (DDR) a...

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SeekIC No. : 004544676 Detail

W3E32M64S-XBX: Features: DDR SDRAM rate = 200, 250, 266, 333Mb/sPackage:• 219 Plastic Ball Grid Array (PBGA),25mm x 25mm, 625mm22.5V ±0.2V core power supply2.5V I/O (SSTL_2 compatible)Differential clock in p...

floor Price/Ceiling Price

Part Number:
W3E32M64S-XBX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

 DDR SDRAM rate = 200, 250, 266, 333Mb/s
 Package:
• 219 Plastic Ball Grid Array (PBGA),
25mm x 25mm, 625mm2
 2.5V ±0.2V core power supply
 2.5V I/O (SSTL_2 compatible)
 Differential clock in puts (CK and CK#)
 Commands entered on each positive CK edge
 Internal pipelined double-data-rate (DDR) ar chi tec ture; two data accesses per clock cy cle
 Programmable Burst length: 2,4 or 8
 Bidirectional data strobe (DQS) transmitted/ re ceived with data, i.e., source-syn chro nous data capture (one per byte)
 DQS edge-aligned with data for READs; centeraligned with data for WRITEs
 DLL to align DQ and DQS transitions with CLK
 Four internal banks for concurrent operation
 Data mask (DM) pins for masking write data (one per byte)
 Programmable IOL/IOH option
 Auto precharge option
 Auto Refresh and Self Refresh Modes
 Commercial, Industrial and Military TemperatureRang es
 Organized as 32M x 64
 User confi gurable as 2x32Mx32 or 4x32Mx16
 Pinout compatible with previous W3E16M64S-XBX version.
 Weight: W3E32M64S-XBX - 2.5 grams typical



Specifications

Parameter   Unit
Voltage on VCC, VCCQ Supply relative to Vss -1 to 3.6 V
Voltage on I/O pins relative to VSS -1 to 3.6 V
Operating Temperature TA (Mil) -55 to +125
Operating Temperature TA (Ind) -40 to +85
Storage Temperature, Plastic -55 to +125

NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause per ma nent damage to the device.  his is a stress rating only and func tion al op er a tion of the device at these or any other conditions greater than those in di cat ed in the operational sections of this specifi cation is not implied. Exposure to ab so lute maximum rating con di tions for extended periods may affect reliability.




Description

The 256MByte (2Gb) DDR SDRAM W3E32M64S-XBX is a high-speed CMOS, dy nam ic ran dom-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM.

The 256MB DDR SDRAM W3E32M64S-XBX uses a double data rate ar chi tec ture to achieve high-speed operation. The double data rate ar chi tec ture is essentially a 2n-prefetch architecture with an in ter face designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 256MB DDR SDRAM effectively consists of a single 2n-bit wide, one-clock-cycle data transfer at the internal DRAM core and two cor re spond ing n-bit wide, one-half-clock-cycle data transfers at the I/O pins.

A bi-directional data strobe (DQS) W3E32M64S-XBX is transmitted externally, along with data, for use in data capture at the receiver. strobe transmitted by the DDR SDRAM during READs and by the memory controller during WRITEs. DQS is edgealigned with data for READs and center-aligned with data for WRITEs. Each chip has two data strobes, one for the lower byte and one for the upper byte.

The 256MB DDR SDRAM W3E32M64S-XBX operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Com mands (ad dress and control signals) are registered at every positive edge of CK. Input data is registered on both edg es of DQS, and out put data is ref er enced to both




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