HEATSINK TO-263 19.38X25.40MM
V-1102-SMD/A-L: HEATSINK TO-263 19.38X25.40MM
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Capacitance : | 18.18 pF | Series: | - |
Manufacturer: | Assmann WSW Components | Type: | Top Mount |
Package Cooled: | TO-263 | Attachment Method: | SMD Pad |
Shape: | Rectangular | Length: | 0.763" (19.38mm) |
Width: | 1.000" (25.40mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.450" (11.43mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - | Thermal Resistance @ Natural: | - |
Material: | Copper |