HEATSINK TO-263 12.70X26.20MM
V-1100-SMD/A-L: HEATSINK TO-263 12.70X26.20MM
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Series: | - | Capacitance : | 18.18 pF |
Manufacturer: | Assmann WSW Components | Type: | Top Mount |
Package Cooled: | TO-263 | Attachment Method: | SMD Pad |
Shape: | Rectangular | Length: | 0.500" (12.70mm) |
Width: | 1.031" (26.20mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.390" (9.91mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | - | Thermal Resistance @ Natural: | - |
Material: | Copper |